A kind of detection method and detection device of pcba board

Abstract

The invention discloses a detection method and a detection device of a PCBA board with an infrared tube touch frame. Through the detection by the method, the short circuit and open circuit of the internal modules of the PCBA board can be detected first, and some internal modules of the PCBA board are statically non-conductive. When the signal cannot be continuously transmitted, the detection device can trigger the static non-conduction module inside the PCBA board to form a path to achieve the purpose of detecting short circuit and open circuit. In the detection process of this method, it is also possible to detect short circuits or paths between pin pins and pin pins inside the PCBA board to be tested. , affecting the function of the PCBA board.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a detection method and detection device for a PCBA board with an infrared tube touch frame. Background technique [0002] In the production of the existing infrared tube touch frame PCBA, packaging technology is generally used to package the infrared tube touch frame PCBA. However, as the integration of the infrared tube touch frame PCBA becomes higher, it becomes more and more difficult to detect its quality. [0003] The current detection method relies on manual visual inspection, or does not inspect, and detects during functional testing during back-end assembly. This detection method is inefficient and prone to missed inspections, and defective products are mixed into finished products, which has an impact on product quality. For the PCBA address line, if there is a short circuit or an open circuit, the defect cannot be detected through the subsequent functional inspection, whi...

AI Technical Summary

Problems solved by technology

However, as the integration of infrared tube touch frame PCBA becomes higher, it becomes more and more difficult to detect its quality.

[0003] The current detection method relies on manual visual inspection, or does not inspect it, and detects it during functional testing during back-end assembly. This detection method is inefficient and prone to missed inspections, and defective products are mixed into finished products, which has an impact on product quality.

For the PCBA address line, if there is a short circuit or an open circuit, the defect cannot be detected through the subsequent functional inspection, which will affect the effect of the product, but it is impossible to have a very fine test effect during production testing, so it is missed. high probability

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