10results about How to "Guaranteed product yield" patented technology

The utility model discloses a multi-station liquid crystal display screen glass substrate automatic alignment cutting device, and relates to the technical field of liquid crystal display screen production. The laser cutting device comprises a cutting table, a displacement assembly is arranged on the upper side of the cutting table, a rotating assembly is arranged at the moving end of the displacement assembly, and an elastic extrusion assembly and a laser gun are arranged at the rotating end of the rotating assembly. The elastic extrusion assembly and the laser gun are driven to move on the glass substrate through the displacement assembly and the rotating assembly, the moving laser gun cuts the glass substrate at the moment, and the elastic extrusion assembly extrudes the two sides of the cutting position of the glass substrate. The cutting position of the glass substrate is not easy to vibrate under the extrusion of the elastic extrusion assembly, and the phenomenon that the adsorption force of the adjustable adsorption assembly is attenuated due to the vibration of the glass substrate is effectively avoided, so that the cutting path of the glass substrate is not easy to deviate, and the edge of the glass substrate is not easy to crack.

This invention relates to the field of wafer acceptance testing technology, and discloses a self-testing method for a wafer probe card, comprising: marking probe groups with an average resistance greater than a resistance threshold as abnormal probe groups; electrically shorting each wire corresponding to the abnormal probe group inside the testing machine to construct a first measurement loop, and measuring the loop resistance value of the first measurement loop; calculating the loop difference between the average resistance value and the loop resistance value: in response to the absolute value of the loop difference being less than or equal to the loop threshold, determining the fault type as poor contact between the probe and the test point interface; in response to the absolute value of the loop difference being greater than the loop threshold, determining the fault type as an internal link fault. This self-testing method for a wafer probe card can distinguish the source of contact abnormalities as either poor contact between the probe and the test point interface or an internal link fault in the testing machine, thereby ensuring the reliability of the wafer probe card self-testing and product yield.

The application provides a quantum storage device, a preparation method and a quantum device, and relates to the technical field of quantum storage devices. The quantum storage device comprises a substrate, a superconducting circuit, at least two support parts, at least two diffusion regions and a superconducting mechanical oscillator. The at least two support parts are arranged vertically on a first surface. The at least two diffusion regions are arranged one by one with the support parts. The at least two diffusion regions are connected with the superconducting mechanical oscillator, so that the superconducting mechanical oscillator is arranged in suspension on the first surface. The superconducting mechanical oscillator comprises a suspension part and at least two cantilever beams, and the cantilever beams are arranged one by one with the diffusion regions. The direction of each cantilever beam is different, so that the at least two cantilever beams jointly form a first branch structure, and the first branch structure is used for reducing the dissipation of vibration energy of the suspension part for the first time based on a dissipative dilution mechanism. The application can guarantee the mechanical stability of the superconducting mechanical oscillator and the preparation yield, and can reduce mechanical loss and improve the quality factor.

The application discloses a display module and a display device. The display module comprises a display area and an edge area arranged around the periphery of the display area. The edge area comprises a flat area and a corner area. The display module comprises a plurality of film layers arranged in layers, a first shielding part and a second shielding part. The first shielding part is arranged between at least part of the film layers, and the first shielding part is located at least in the corner area. The second shielding part is arranged around at least part of the area in the flat area and is in contact with at least part of the film layers. The first shielding part and the second shielding part are both grounded. The display module provided by the application has enhanced anti-static capability, and the adverse effects of static electricity on the display effect are reduced.

The invention relates to the technical field of plastic knob forming, in particular to a forming mold for electric appliance plastic knob production, which comprises a central column, the central column is a hexagonal column, the two ends of the central column are respectively concaved inwards to form a first groove and a second groove, and the central column is sleeved with a driving motor through the first groove; the output end of the driving motor penetrates through the center column and extends to the inner side of the second groove, the center column is rotationally sleeved with a rotating shaft through the first groove, first air cylinders are installed at the end, away from the driving motor, of the rotating shaft in an array mode, and a forming assembly is arranged at the output end of the driving motor. According to the plastic knob forming device, the center column of the hexagonal structure is arranged, the forming assembly, the cooling assembly, the cleaning assembly and the demolding structure are integrated on the periphery of the center column, a multi-station linkage layout is formed, continuous operation of the plastic knob in the forming, cooling, cleaning and demolding procedures is achieved, and the production efficiency is effectively improved.

The application discloses a display device, relates to the technical field of display, and aims to solve the problem of how to improve the assembly precision of a screen and a back cover and improve the yield of finished products. The display device comprises a middle frame and a back cover. The back cover comprises a bottom wall and a side frame arranged at the edge of the bottom wall. An end surface of the side frame, which faces away from the bottom wall, comprises a support surface area. The middle frame is accommodated in the back cover, and the edge of the middle frame is provided with an extension part. The extension part forms a limiting boss, and the limiting boss is used for limiting the installation height of the edge of the screen relative to the support surface area. The extension part comprises a first surface and a second surface arranged along the thickness direction of the limiting boss, and a side surface located between the first surface and the second surface. The first surface is a surface of the extension part which faces away from the side frame. A curved transition area is arranged at the connection area of the first surface and the side surface. The display device is used for displaying images.

This application provides a winding fixture for a modular stator, relating to the field of machining technology. It includes a base, a rotating spindle mounted on the base, a winding fixture mounted on the top of the rotating spindle, and a pressing assembly above the winding fixture. The top surface of the winding fixture is a contoured surface. The pressing assembly includes two pressing shafts mounted on both ends of the base via linear bearings. Mounting plates are mounted on the upper ends of the two pressing shafts, and horizontal plates are mounted on the lower ends. A push-down cylinder is installed between the base and the horizontal plates. A pressure rod body coaxial with the rotating spindle is rotatably mounted on the mounting plate. A pressing head with a circular arc surface is mounted on the bottom of the pressure rod body. The pressing head is used to press and clamp the inner circumference of the modular stator. An angle positioning mechanism is also provided at the upper end of the pressure rod body for positioning the pressing head. This application improves the positioning accuracy and clamping reliability of the modular stator during the winding process by combining a winding fixture with a contoured surface, a pressing head, and an angle positioning mechanism.

The utility model discloses a double-station feeding structure for glass production detection, and relates to the technical field of glass detection. The feeding device comprises a support, two clamping mechanisms and two feeding mechanisms are arranged on the support, each clamping mechanism comprises a connecting block arranged in the support, two first grooves are formed in the top of each connecting block, second grooves are formed in the bottoms of the two first grooves, each feeding mechanism comprises a third groove formed in the top of the support, and the second grooves are formed in the bottoms of the second grooves. And the outer wall of the connecting block is slidably connected with the third groove, a fourth groove is formed in the inner wall of the third groove, and the inner walls of the two first grooves are each slidably connected with two first sliding blocks. According to the feeding structure for the double-station glass production detection, by arranging the clamping mechanism, the problems that in the using process of an existing feeding structure for the double-station glass production detection, glass needing to be detected is inconvenient to clamp, in the feeding process, the glass is prone to deviation, and consequently the feeding process is blocked and even the glass falls off and is damaged are solved; and the production efficiency and the product yield are seriously influenced.

This utility model relates to the field of injection molding machine ejection, specifically to a buffer structure for an injection molding machine ejection device. The structure includes a plunger with a connecting post fixedly connected to its bottom, the connecting post having external threads on its outer wall; and a buffer assembly comprising a rubber block snapped onto the top of the plunger, a mating assembly between the rubber block and the plunger, a buffer frame fixedly connected to the top of the rubber block, a silicone pad fixedly connected to the top of the buffer frame, and a protrusion fixedly connected to the upper surface of the silicone pad. Through the design of the buffer assembly, the impact force of the ejector pin can be gradually dissipated from small to large, thereby stabilizing the ejection of the injection molded part while minimizing the risk of damage. This is especially beneficial for thin-walled, easily deformable injection molded parts, effectively reducing impact damage during ejection and ensuring high production yield.

The application discloses a composite disc temperature control method and system, and belongs to the field of semiconductor manufacturing. The method comprises the following steps: dividing the composite disc into multiple independent partitions for real-time sensing, and constructing multiple partition real-time temperature curves; performing temperature difference analysis based on the multiple partition real-time temperature curves, calculating temperature difference data and temperature difference coupling correlation information; dynamically adjusting the multiple independent partitions according to the temperature difference data and the temperature difference coupling correlation information, and obtaining a temperature control result; color coding the composite disc based on the temperature control result, constructing a temperature sensing map for automatic temperature adjustment, generating a temperature adjustment effect for temperature verification, and performing temperature control grading alarm according to verification data. The application solves the technical problem that the product yield is low due to the large difference in material thermal conductivity characteristics of the existing composite disc.