The invention discloses a method for 
machining through holes and blind holes of multi-layer flexible board. The 
machining method comprises the steps that: the multilayer flexible board is baked for 40 min-60 min at the temperature of 120 DEG C-140 DEG C; a 
phenolic aldehyde base plate, the multi-layer flexible board and a cold 
punching cover plate are stacked from bottom to top to form a fixed 
package, and the fixed 
package is fixed at a preset positioning point; and a 
drill pin is used for drilling from the cold 
punching cover plate to the multi-layer flexible plate according to standard drilling parameters at the preset position of the fixed 
package, wherein the standard drilling parameters include the tool speed of the 
drill pin entering the multi-layer flexible board,the rotating speed of the 
drill pin in the multi-layer flexible board and the tool speed of the drill pin retreating from the multi-layer flexible board, wherein the tool speed of the drill pin entering the multi-layer flexible board is 0.7 m / min-0. 8 m / min, the rotating speed of the drill pin in the multi-layer flexible board is 60 Kr / min-70 Kr / min, and the tool speed of the drill pin retreating from the multi-layer flexible board is 5m / min-8m / min. The 
machining method for the blind holes of the multi-layer flexible board comprises the steps that: a 
copper window is formed in a 
copper layer of the multi-layer flexible board through a 
UV laser machine; and a base material layer is heated to a 
molten state by using a CO2 
laser machine, and is gasified, so that blind holes can be formed. The flexible 
printed circuit board has high high-frequency 
signal transmission performance and high 
temperature resistance, so that the performance of a product formed by the 
matching methods of the invention is more stable and reliable.