32results about How to "High speed signal transmission" patented technology

An electric connector includes an insulating housing having slots arranged crosswise in vertical columns and horizontal lines, and signal terminals received in the slots. The signal terminals are paired to be received in each and every slot. The slots are staggered in vertical columns. The slots are so arranged that the ratio of “a” / “b” may be equal to or smaller than ⅓, where “a” stands for the distance between two signal terminals in each pair, and “b” stands for the distance between adjacent pair sets of signal terminals.

An electric connector assembly includes mutually paired socket electric connector and plug electric connector. The socket electric connector comprises a and a plurality of first terminals held in thesocket insulation body, wherein the socket insulation body is provided with a main body portion and a expansion portion extending outwards from the main body portion. The plug electric connector comprises a plug insulation body and a plurality of second terminals accommodated in the plug insulation body. The first and second terminal are respectively provided with a contact portion, a holding portion held with the insulation body and a tail extending outside the insulation body, the first and second terminal both includes two rows of terminal sets, each row of terminal set is provided with two pairs of differential signal terminals for transmitting signals, a grounding terminal is provided between the two pairs of differential signal terminals, and one pair of differential signal terminals are located farthest outboard of the terminal set. The electric connector assembly and its socket electric connector and plug electric connector realize the high speed signal transmission between the backboard and the mainboard.

The invention discloses a data acquisition serial-parallel conversion storage device and method for ensuring the effective storage of data. The data acquisition serial-parallel conversion storage device comprises a serial shift register, a first parallel shift register, a second parallel shift register, a phase locked loop (PLL) circuit, a frequency dividing circuit and a counting circuit, wherein the serial shift register, the first parallel shift register and the second parallel shift register are sequentially connected; the phase locked loop (PLL) circuit is connected with the serial shift register; the frequency dividing circuit is respectively connected with the first parallel shift register and the second parallel shift register; the counting circuit is connected with the first parallel shift register; the serial shift register receives an output signal of a receiver; the second parallel shift register is connected with a logical circuit; and the phase locked loop (PLL) circuit is respectively connected with the counting circuit and the frequency dividing circuit.

A structure of a USB connector comprising an isolation chassis and an electric module is provided. The circuit board has a plurality of interconnection-terminals and a plurality of adaptor-terminals, wherein the power wave-filter module is positioned in a positive and negative power line of the circuit board and electrically connects to a first terminal and a fourth terminal of the interconnection-terminals and the signal wave-filter module is positioned in a signal line of the circuit board and electrically connects to a second terminal and a third terminal of the interconnection-terminals so as to cancel noise generated during signal transmission.

A connector has a plurality of high-speed differential signal lanes each of which includes two first contacts for high-speed differential signal transmission and two ground contacts. A second contact which does not belong to the high-speed differential signal lanes is arranged between the high-speed differential signal lanes. On a first connection side for connection with a connecting object, contacting portions of the contacts are arranged in a single row at a distance from one another. On a second connection side for connection with a mounting object, terminal portions of the first contacts and terminal portions of the ground contacts are arranged in a first row at a distance wider than that between the contacting portions while a terminal portion of the second contact is arranged in a second row.

Provided is a transmitter circuit capable of transmitting a signal at a high speed because signal waveform distortion in an input terminal of a receiving circuit is reduced even though a transmission path has a high resistance component such as aluminum wiring and cooper wiring on a glass substrate and to provide a transmission circuit and a driving device. The transmitter circuit comprises: a non-inverting output terminal and an inverting output terminal, for outputting a signal current, which has a loop direction that changes based upon an input signal, to the non-inverting and inverting output terminals; and an output-waveform control circuit for detecting the edge of the waveform of the input signal and responding by increasing the signal current temporarily.

The embodiment of the invention discloses an inner wire arranging system of a via hole type Ethernet communication sliding ring. The inner wire arranging system of the via hole type Ethernet communication sliding ring comprises rotor terminal core wires and stator terminal core wires, wherein the rotor terminal core wires correspond to conducting rings in a one-to-one mode and connected between the inner walls of the conducting rings and first communication ends respectively. The stator terminal core wires are connected between the tail ends of electric brushes and second communication terminals respectively. The rotor terminal core wires and the stator terminal core wires adopt the core wire twisting rule in eight core net wires to arrange the eight core net wires to form four twisted pairs. The color of the rotor terminal core wires connected to the inner walls of the conducting rings is identical with the color of the stator terminal core wires connected to the electric brush, wherein the electric brush and the conducting rings are in the sliding friction state. The requirement for higher data transmission rate of the Ethernet with stronger communication capability can be met.

The invention discloses a roadbed automatic driving auxiliary detection system and a control method thereof. The system comprises a millimeter-wave radar module, a main control module, a communication module, a GPS module, a cloud server and a vehicle-mounted terminal, the main control module is connected with the millimeter-wave radar module and the GPS module and controls the millimeter-wave radar module and the GPS module to work; and radar detection data and GPS data are acquired, repackaged and sent to a cloud server through the communication module. According to an existing millimeter wave radar principle, a DBCAN clustering algorithm and an extended Kalman filtering algorithm, movement conditions of vehicles and pedestrians on a road are monitored in real time, and positions and movement information of the vehicles and the pedestrians around a region where a driver and an automatic driving system are located can be provided for the driver and the automatic driving system, so that blind areas existing in observation are reduced, the timeliness of information transmission in a high-speed driving scene is guaranteed, safe driving is facilitated, and therefore traffic travel is more efficient, convenient and safe.

A multilayer wiring board having a first layer and a second layer laminated with a ground conductor, respectively, and having a differential wire line configured with a first wire line and a second wire line, includes a pair of through-holes and which is formed in the first layer and the second layer and electrically connects the first wire line and the second wire line arranged on one surface of the multilayer wiring board and the first wire line and the second wire line arranged on the other surface of the multilayer wiring board, respectively; and clearances and which insulate the ground conductor and the through-holes and, in which the pair of through-holes formed in the second layer is arranged so that a virtual line connecting centers of the pair of through-holes is inclined with respect to a line perpendicular to a signal propagation direction of the differential wire line.

The invention discloses a method for machining through holes and blind holes of multi-layer flexible board. The machining method comprises the steps that: the multilayer flexible board is baked for 40 min-60 min at the temperature of 120 DEG C-140 DEG C; a phenolic aldehyde base plate, the multi-layer flexible board and a cold punching cover plate are stacked from bottom to top to form a fixed package, and the fixed package is fixed at a preset positioning point; and a drill pin is used for drilling from the cold punching cover plate to the multi-layer flexible plate according to standard drilling parameters at the preset position of the fixed package, wherein the standard drilling parameters include the tool speed of the drill pin entering the multi-layer flexible board,the rotating speed of the drill pin in the multi-layer flexible board and the tool speed of the drill pin retreating from the multi-layer flexible board, wherein the tool speed of the drill pin entering the multi-layer flexible board is 0.7 m / min-0. 8 m / min, the rotating speed of the drill pin in the multi-layer flexible board is 60 Kr / min-70 Kr / min, and the tool speed of the drill pin retreating from the multi-layer flexible board is 5m / min-8m / min. The machining method for the blind holes of the multi-layer flexible board comprises the steps that: a copper window is formed in a copper layer of the multi-layer flexible board through a UV laser machine; and a base material layer is heated to a molten state by using a CO2 laser machine, and is gasified, so that blind holes can be formed. The flexible printed circuit board has high high-frequency signal transmission performance and high temperature resistance, so that the performance of a product formed by the matching methods of the invention is more stable and reliable.

An electrical connector is used for a plug having multiple pins to downward insert therein. The electrical connector includes a body provided with multiple accommodating holes running through an upper surface and a lower surface of the body; and multiple terminals correspondingly accommodated in the accommodating holes. Upper ends of the terminals are located at a same height, and lower ends of the terminals are located at a same height. Each terminal has two contact arms opposite and close to each other. The terminals include a first terminal and a second terminal. The two contact arms of the first terminal and the two contact arms of the second terminal are located at different heights and correspondingly used for the pins to insert downward therein successively. Thus, signal interference between the terminals can be reduced, and a maximum insertion force of the plug inserted into the electrical connector is reduced.

The embodiment of the invention discloses an inner wire arranging system of a via hole type Ethernet communication sliding ring. The inner wire arranging system of the via hole type Ethernet communication sliding ring comprises rotor terminal core wires and stator terminal core wires, wherein the rotor terminal core wires correspond to conducting rings in a one-to-one mode and connected between the inner walls of the conducting rings and first communication ends respectively. The stator terminal core wires are connected between the tail ends of electric brushes and second communication terminals respectively. The rotor terminal core wires and the stator terminal core wires adopt the core wire twisting rule in eight core net wires to arrange the eight core net wires to form four twisted pairs. The color of the rotor terminal core wires connected to the inner walls of the conducting rings is identical with the color of the stator terminal core wires connected to the electric brush, wherein the electric brush and the conducting rings are in the sliding friction state. The requirement for higher data transmission rate of the Ethernet with stronger communication capability can be met.

The invention discloses an optical module, which includes a first photodetector, a delay circuit, a second photodetector, and a logic gate circuit, wherein: the first photodetector converts the received optical signal of the first wavelength into a first The electrical signal is used to transmit the first electrical signal to the delay circuit; the delay circuit is used to delay the first electrical signal and input it to the logic gate circuit; the second photodetector is used to convert the received optical signal of the second wavelength into a second electrical signal, The second electrical signal is input into the logic gate circuit; the logic gate circuit combines the second electrical signal with the delayed first electrical signal and outputs it. The invention can reduce the requirement on the receiver, realize the doubling of the rate, and solve the problem of the receiving rate of the access network.

A cable connector assembly includes: an electrical connector; a circuit board electrically connected to the electrical connector and including a first row of pads and a second row of pads located behind the first row of pads and separated from the first row of pads; and a cable electrically connected to the circuit board and including plural coaxial wires each including a center conductor and a shielding layer and plural single core wires each comprising a conductor; wherein the center conductors of the coaxial wires are soldered to the first row of pads of the circuit board, and the conductors of the single core wires and the shielding layers of the coaxial wires are soldered to the second row of pads of the circuit board.

A semiconductor chip (20) having protruding electrodes (bumps) (23) on external lead-out electrodes is mounted on a wiring board (10), and a semiconductor chip (30) is mounted on the semiconductor chip (20). Between the wiring layer (12) of the wiring substrate (10) and the protruding electrodes (23) of the semiconductor chip (20), and between the protruding electrodes of the semiconductor chips (20), (30) are electrically connected by electrolytic plating. Between the wiring layer (12) and the protruding electrodes (23) and between the protruding electrodes of the semiconductor chip (20) (30) are stably connected through the plating films (24), (33).