Methods for machining through holes and blind holes of multi-layer flexible board
A processing method and soft board technology, which is applied in the processing of insulating substrates/layers, circuit substrate materials, electrical components, etc., can solve problems such as inability to meet customer processing requirements, high water absorption, etc., and achieve good high temperature resistance and stable circuits reliable effect
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[0033] Embodiment one: see Figure 1~3 As shown, a method for making a soft board includes:
[0034] A substrate layer 1 made of PTFE material is provided with a copper layer 2 and processed to form a substrate with circuits;
[0035] The adhesive layer 3 and the outer layer board 4 are sequentially stacked outward from the side of the substrate and pressed together by a high-temperature pressing machine to form a soft board; wherein, the pressing temperature is 190°C-200°C, and the pressing time is 4h- 4.5h.
[0036] The Chinese name of PTFE is polytetrafluoroethylene, which is a high molecular polymer obtained by polymerization of tetrafluoroethylene as a monomer. PTFE has the characteristics of anti-acid, anti-alkali, and various organic solvents, and is almost insoluble in all solvents. At the same time, PTFE has the characteristics of high temperature resistance. Therefore, using the substrate layer 1 made of PTFE material, the copper layer 2 is placed on the substrat...
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