Methods for machining through holes and blind holes of multi-layer flexible board

Abstract

The invention discloses a method for machining through holes and blind holes of multi-layer flexible board. The machining method comprises the steps that: the multilayer flexible board is baked for 40 min-60 min at the temperature of 120 DEG C-140 DEG C; a phenolic aldehyde base plate, the multi-layer flexible board and a cold punching cover plate are stacked from bottom to top to form a fixed package, and the fixed package is fixed at a preset positioning point; and a drill pin is used for drilling from the cold punching cover plate to the multi-layer flexible plate according to standard drilling parameters at the preset position of the fixed package, wherein the standard drilling parameters include the tool speed of the drill pin entering the multi-layer flexible board,the rotating speed of the drill pin in the multi-layer flexible board and the tool speed of the drill pin retreating from the multi-layer flexible board, wherein the tool speed of the drill pin entering the multi-layer flexible board is 0.7 m / min-0. 8 m / min, the rotating speed of the drill pin in the multi-layer flexible board is 60 Kr / min-70 Kr / min, and the tool speed of the drill pin retreating from the multi-layer flexible board is 5m / min-8m / min. The machining method for the blind holes of the multi-layer flexible board comprises the steps that: a copper window is formed in a copper layer of the multi-layer flexible board through a UV laser machine; and a base material layer is heated to a molten state by using a CO2 laser machine, and is gasified, so that blind holes can be formed. The flexible printed circuit board has high high-frequency signal transmission performance and high temperature resistance, so that the performance of a product formed by the matching methods of the invention is more stable and reliable.

Description

technical field [0001] The invention relates to the field of flexible boards, in particular to a method for processing through holes and blind holes of multilayer flexible boards. Background technique [0002] The existing soft board substrates generally use PI or MPI. PI is a conventional soft material dielectric layer, and MPI is a high-frequency conventional PI material. Existing substrate materials will have high water absorption during use. Therefore, the existing substrate materials cannot meet the needs of products that require high-speed transmission performance, and can no longer meet the increasingly high processing requirements of customers. Contents of the invention [0003] In order to overcome the defects in the prior art, the embodiment of the present invention provides a method for processing through holes and blind holes of multi-layer flexible boards, so that products such as circuit boards formed by using the flexible boards can realize high-speed trans...

AI Technical Summary

Problems solved by technology

Existing substrate materials will have high water absorption during use. Therefore, the existing substrate materials cannot meet the needs of products that require high-speed transmission performance, and can no longer meet the increasingly high processing requirements of customers.

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