Glass substrate cutting and bearing device and cutting system

A technology for glass substrates and carrying devices, applied in glass cutting devices, glass manufacturing equipment, manufacturing tools, etc., can solve problems such as scratched glass substrates, defective display panels, etc., and achieve the effect of ensuring product yield

Active Publication Date: 2014-12-17
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] like figure 1 As shown, the glass substrate is placed on the carrier platform composed of the upstream station 2 and the downstream station 3, the glass substrate is separated from the position of the cutting line, and a step is formed at the cutting position of the left glass substrate 4 When the downstr

Method used

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  • Glass substrate cutting and bearing device and cutting system
  • Glass substrate cutting and bearing device and cutting system

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0017] see figure 2 , The best embodiment of the present invention provides a glass substrate cutting carrier, which includes an upstream carrier 10 , a downstream carrier 15 , an auxiliary carrier 20 and a moving support 25 . The upstream carrier table 10 and the downstream carrier table 12 jointly carry the glass substrate 30 to be cut, the downstream carrier table 15 and the auxiliary carrier table 20 are installed on the mobile support 25, and the auxiliary ca...

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PUM

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Abstract

The invention provides a glass substrate cutting and bearing device, comprising an upstream bearing platform, a downstream bearing platform, an auxiliary bearing platform and a mobile bracket, wherein the downstream bearing platform is arranged adjacently to the upstream bearing platform; the upstream bearing platform, the auxiliary bearing platform and the downstream bearing platform jointly load a to-be-cut glass substrate; the downstream bearing platform and the auxiliary bearing platform are arranged on the mobile bracket; the auxiliary bearing platform is arranged between the upstream bearing platform and the downstream bearing platform and is connected with a lifting drive element; the lifting drive element adjusts the height of the auxiliary bearing platform relatively to the upstream bearing platform; and after the glass substrate is cut, the auxiliary bearing platform ascends to the height of the overhead upstream bearing platform, is propped against the cut glass substrate, and drives the downstream bearing platform and the auxiliary bearing platform to depart from the upstream bearing platform through the mobile bracket.

Description

technical field [0001] The invention relates to the field of liquid crystal panels, in particular to a glass substrate cutting carrier device and a cutting system. Background technique [0002] The general structure of the existing glass substrate includes: a TFT substrate and a CF substrate laminated up and down, and liquid crystal molecules poured between the TFT substrate and the CF substrate. The prepared glass substrates are then cut and separated according to the size of different displays. The existing cutting technology is to use an upper cutter head and a lower cutter head to respectively cut the TFT substrate and the CF substrate at the gap between the upstream suction table and the downstream suction table. [0003] Such as figure 1 As shown, the glass substrate is placed on the carrier platform composed of the upstream station 2 and the downstream station 3, the glass substrate is separated from the position of the cutting line, and a step is formed at the cutt...

Claims

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Application Information

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IPC IPC(8): C03B33/02
Inventor 邓鸿韬
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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