Display substrate, manufacturing method thereof and display device

A display substrate and manufacturing method technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as general climbing ability, breakage, poor display, etc., and achieve the effect of ensuring connection reliability and product yield

Pending Publication Date: 2020-08-11
BOE TECH GRP CO LTD +1
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Problems solved by technology

The depth of the second via hole is relatively large, and the slope angle of the second via hole formed after the dry etching process is generally 80-90°. When ITO is subsequently deposited on the

Method used

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  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device
  • Display substrate, manufacturing method thereof and display device

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[0034] In order to make the technical problems, technical solutions, and advantages to be solved by the embodiments of the present invention clearer, a detailed description will be given below with reference to the drawings and specific embodiments.

[0035] In the manufacturing process of OLED display devices, after depositing the passivation layer, a flat layer needs to be deposited. The flat layer can be made of photosensitive acrylic material, and the flat layer is exposed and developed to form the first via hole penetrating the flat layer; A photoresist is formed on the photoresist, and the photoresist is exposed and developed to form a photoresist pattern. Using the photoresist pattern as a mask, the passivation layer is etched, and a dry etching process is used to form the first passivation layer. Two vias. The depth of the second via hole is relatively large. The slope angle of the second via hole formed after the dry etching process is generally 80-90°. When ITO is subse...

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Abstract

The invention provides a display substrate, a manufacturing method thereof and a display device, and belongs to the technical field of display. The display substrate comprises a first conductive pattern, an insulating layer and a second conductive pattern which are sequentially arranged in the direction, away from the display substrate, of a substrate body, the first conductive pattern and the second conductive pattern are connected through a via hole penetrating through the insulating layer, and the slope angle of the side wall of the via hole is not larger than 60 degrees. According to the technical scheme, the product yield of the display device can be improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device. Background technique [0002] Recently, large-size OLED (organic electroluminescent diode) display devices have gradually become the mainstream of the display industry due to their advantages such as high contrast and self-illumination. In the manufacturing process of OLED display devices, after the passivation layer is deposited, a flat layer needs to be deposited. The flat layer can be made of photosensitive acrylic material, and the flat layer is exposed and developed to form the first via hole through the flat layer; Form a photoresist on the photoresist, expose and develop the photoresist to form a pattern of the photoresist, use the pattern of the photoresist as a mask, etch the passivation layer, and form the first passivation layer through the dry etching process Two vias. The depth of t...

Claims

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Application Information

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IPC IPC(8): H01L27/32
CPCH10K59/12H10K59/124H10K59/1201
Inventor 张扬刘宁周斌程磊磊王庆贺郭清化
Owner BOE TECH GRP CO LTD
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