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Substrate Bonding Method

A substrate and adhesive layer technology, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve problems such as difficult adjustment of alignment errors, and achieve the effect of adhesive overflow

Active Publication Date: 2016-08-24
MIRLE AUTOMATION CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] When the form of the adhesive layer is solid or condensed, it is easier to form air bubbles between the two rigid substrates because the air is not easily removed when it is applied to the bonding of the rigid substrate and the rigid substrate. In addition, if alignment occurs Inaccurate, and difficult to adjust its alignment error

Method used

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Embodiment Construction

[0031] In order to make the above content of the present invention more comprehensible, preferred embodiments are specifically cited below, together with the accompanying drawings, and described in detail as follows.

[0032] Please refer to figure 1 , which is a flow chart of the steps of the substrate bonding method in the embodiment of the present invention, the method includes the following steps:

[0033] In step S11, a first substrate is provided. In this embodiment, the first substrate includes a flexible substrate, a glass substrate or a plastic substrate, etc., but the present invention is not limited thereto.

[0034] In step S12, an adhesive is coated on the first substrate to form an adhesive layer. The adhesive includes an ultraviolet curable adhesive or a heat curable adhesive.

[0035] In step S13, a pre-curing process is performed on the adhesive layer, so that part of the adhesive layer is in a liquid state and part is in a condensed state. In the aforemen...

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Abstract

The invention discloses a method for adhering substrates, which is to implement a pre-curing process on an adhesive layer on a substrate, so that part of the adhesive layer is in a liquid state and part is in a condensed state, and then the other The substrate is disposed on the adhesive layer of this aspect. In addition to adjusting the alignment error between the aforementioned two substrates, the present invention can also solve the problem of adhesive overflow.

Description

technical field [0001] The invention relates to a bonding method between substrates. Background technique [0002] In an existing bonding method, an adhesive is applied to the contact surface between two substrates to be bonded, and then a curing process corresponding to the adhesive is performed, so as to complete the bonding of the aforementioned two substrates. However, since the existing bonding method only utilizes one type of glue to bond the two substrates, that is, the state of the adhesive layer formed by the adhesive after coating is liquid, solid, and solidified. One of the states, so the adhesive layers of these types have the following disadvantages respectively: [0003] When the adhesive layer is in a liquid state, the liquid adhesive in the adhesive layer will overflow from its side when the two substrates are pressed together during the bonding process; [0004] When the form of the adhesive layer is solid, there is a problem of lack of compressive elastic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12
Inventor 杨朝贵黄进昌桂武俊
Owner MIRLE AUTOMATION CORPORATION
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