Substrate adhesion method

A substrate and adhesive layer technology, applied in chemical instruments and methods, layered products, lamination devices, etc., can solve problems such as difficulty in adjusting alignment errors, and achieve the effect of solving adhesive overflow
CN104210218AActive Publication Date: 2014-12-17MIRLE AUTOMATION CORPORATION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
MIRLE AUTOMATION CORPORATION
Publication Date
2014-12-17

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Abstract

The invention discloses a substrate adhesion method, which is characterized in that an adhesion layer on the substrate is precured, then a part of the adhesion layer is in a liquid state and a part of the adhesion layer is in a condensed state, and the other substrate is arranged on the adhesion layer. The substrate adhesion method can adjust the contraposition error between two substrates and can solve the spillover problem of an adhesive.
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Description

technical field

[0001] The invention relates to a bonding method between substrates. Background technique

[0002] In an existing bonding method, an adhesive is applied to the contact surface between two substrates to be bonded, and then a curing process corresponding to the adhesive is performed, so as to complete the bonding of the aforementioned two substrates. However, since the existing bonding method only utilizes one type of glue to bond the two substrates, that is, the state of the adhesive layer formed by the adhesive after coating is liquid, solid, and solidified. One of the states, so the adhesive layers of these types have the following disadvantages respectively:

[0003] When the adhesive layer is in a liquid state, the liquid adhesive in the adhesive layer will overflow from its side when the two substrates are pressed together during the bonding process;

[0004] When the form of the adhesive layer is solid, there is a problem of lack of compressive elastic...

Claims

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