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Liquid cooling cabinet door

A liquid-cooled heat dissipation and cabinet technology, which is used in the field of server and communication equipment cabinets, can solve the problems of unstable, weak, and insufficient cold air flow in the server cabinet system, and achieves high thermal density and thermal dead zone. Consumption and simple structure

Active Publication Date: 2018-03-27
BEIJING XINGDA TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]The number of server cabinets is increasing, and the arrangement of cabinets is becoming more and more dense. The cold air blown by the traditional cooling air-conditioning system cannot fully flow to all parts of the computer room. As a result, hot air is easy to concentrate in a specific area, forming a thermal dead zone, which will naturally cause instability in the server cabinet system
At the same time, the heat dissipation of traditional air conditioners can only maintain the ambient temperature outside the cabinet, and can only play a very weak role in the heat generated in the cabinet.

Method used

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Embodiment Construction

[0026] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. The elements and features described in one drawing or one embodiment of the present invention may be combined with the elements and features shown in one or more other drawings or embodiments. It should be noted that, for the purpose of clarity, representations and descriptions of components and processes that are not related to the present invention and known to those of ordinary skill in the art are omitted from the drawings and descriptions. Based on the embodiments of the present invention, all other embodiments obtained by those of ...

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Abstract

The invention provides a liquid-cooled and heat-dissipating cabinet door, which includes a door panel module, a heat exchange module and a fan module; the door panel module includes a door body; one side of the door body is provided with a heat exchange module, and one side of the heat exchange module is provided with a fan module; the fan module is used to cool the hot air through the heat exchange module and then discharge the door panel module. The liquid-cooled and heat-dissipating cabinet door provided by the present invention improves the heat dissipation efficiency of the cabinet, solves the heat dissipation problem of high-density data computer rooms, reduces energy consumption and operating costs of the computer room, has high heat dissipation efficiency, simple structure, convenient installation, and high safety performance.

Description

Technical field [0001] The invention relates to the field of cabinets for servers and communication equipment, and in particular to a liquid-cooled heat-dissipating cabinet door. Background technique [0002] With the rapid development of supercomputer technology and the emergence of rack and blade servers, server cabinets with high heat flux have been widely used in the field of supercomputers. The mixed use of high density and low density servers makes the heat density of the server Imbalance, resulting in an imbalance of heat in the computer room. The traditional centralized air supply of air conditioners can no longer meet its heat dissipation requirements. In the past ten years, server density has increased by an average of about ten times. In the field of supercomputers, cooling energy accounts for a considerable proportion of overall energy consumption. As energy prices continue to rise, the cooling problem has become an unavoidable problem for all data centers. [0003] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 杨辉张军奎柴容杨谦范志远
Owner BEIJING XINGDA TECH DEV
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