Support element for supporting substrate and support device

A technology for supporting substrates and supports, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as uneven display of liquid crystal displays, and achieve the effects of increasing yield, improving yield, and displaying uniformity

Inactive Publication Date: 2015-11-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide a support and a support device for supporting a substrate, so as to solve the problem that when the support wi

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  • Support element for supporting substrate and support device
  • Support element for supporting substrate and support device
  • Support element for supporting substrate and support device

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Embodiment Construction

[0026] The implementation process of the embodiment of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention. At the same time, in the description of the present invention, the orientation or positional relationship indicated by the terms "upper", "lower", "above", "below" etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention It is not intended that the invention must be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

[0027] Such...

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Abstract

The invention discloses a support element for supporting a substrate and a support device, and aims at solving the problem that when the support element and the substrate, which are different in temperature, contact with each other, Mura is generated at the contact part, so that a finished liquid crystal display is uneven in display. The support element for supporting the substrate comprises a body with a hollow structure, a temperature sensor, a heating component, a heat-conducting liquid, a first lead and a second lead, wherein the temperature sensor, the heating component and the heat-conducting liquid are arranged in the hollow structure of the body; the first lead is connected to the temperature sensor; the second lead is connected to the heating component; the temperature sensor is attached to the inner wall of the body and is used for sensing the temperature data of the body; the heating component is used for providing heat energy for the heat-conducting liquid; the heating component and the heat-conducting liquid are insulated with each other; the heat-conducting liquid is used for transferring the heat energy provided by the heating component to the body; the first lead and the second lead extend outside the body from the hollow structure of the body; the first lead is used for transmitting the temperature data sensed by the temperature sensor; and the second lead is used for supplying electricity to the heating component.

Description

technical field [0001] The invention relates to the technical field of substrate preparation, in particular to a support and a support device for supporting a substrate. Background technique [0002] In the production of liquid crystal displays (Liquid Crystal Display, LCD), there will be multiple processes (such as annealing, baking, etc.) to raise or control the temperature of the substrate to form a good film or eliminate stress. In these processes, the substrate needs to be placed on a support to support the substrate by the support. [0003] The substrate supports currently used in the production line are made of solid materials with uncontrollable temperature. When the support contacts the substrate, the temperature of the support is usually lower than that of the substrate, so the support absorbs the heat on the substrate through heat transfer, thereby As a result, the film quality at the contact between the substrate and the support is poor, and the Mura phenomenon ...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67109H01L21/683
Inventor 张普国王志强杨立涛
Owner BOE TECH GRP CO LTD
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