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Motor-driven circuit board device assembly

A technology of motor drive and circuit board, which is applied in the direction of printed circuits connected with non-printed electrical components, cooling/ventilation/heating transformation, etc., which can solve the problem of targeted heat dissipation of heat dissipation chips, difficulties in later maintenance, and difficulty in maintenance and installation by users And other issues

Inactive Publication Date: 2016-01-13
方小刚
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
If the positioning is inaccurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting the operation stability and reliability of the overall system of the circuit board

Method used

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  • Motor-driven circuit board device assembly
  • Motor-driven circuit board device assembly

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Embodiment Construction

[0009] Combine below Figure 1-2 The present invention will be described in detail.

[0010] A circuit board device assembly driven by a motor according to an embodiment includes a circuit board device 12, a hinged frame 9 fixedly arranged at one end of the circuit board device 12, and a cooling plate device 2 connected to the hinged frame 9, Wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for connecting with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable clamping positioning block 5 respectively. One end of the hinge frame 9 is also fixed with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and one end of the horizontal guide rod 14 wound with the horizontal tension spring 13. connected, the other end of the vertical guide rod 3 and the other end of the horizontal guide rod 14 are respectively fixedly connect...

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PUM

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Abstract

The invention discloses a motor-driven circuit board device assembly. The motor-driven circuit board device assembly comprises a circuit board device (12), a hinge frame (9) and a cooling plate device (2), wherein the hinge frame (9) is fixedly arranged on one end of the circuit board device (12), the cooling plate device (2) is connected with the hinge frame (9), a vertical guide-rail groove (10) and a horizontal guide-rail groove (7) are formed in a main body block (91) of the hinge frame (9), the vertical guide-rail groove (10) is in sliding fit with one end of a clamping and positioning block (11) which can slide vertically, the horizontal guide-rail groove (7) is in sliding fit with one end of a clamping and positioning block (5) which can slide horizontally, and the main body block (91) of the hinge frame (9) is fixedly connected with one end of a vertical guide rod (3) wound with a vertical extension spring (4) and one end of a horizontal guide rod (14) wound with a horizontal extension spring (13).

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board assembly driven by a motor. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/18
Inventor 方小刚
Owner 方小刚