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Circuit board apparatus assembly with adjustable air feed speed and LED lamp

A technology for LED lamps and circuit boards, which is applied in the directions of printed circuits, electrical components, and printed circuits that are connected with non-printed electrical components, can solve the problems affecting the targeted heat dissipation of heat dissipation chips, difficulty in post-maintenance, and difficult positioning and installation of heat dissipation devices. Open maintenance and other issues

Inactive Publication Date: 2016-03-09
方小刚
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But this heat dissipation mode is easy to cause problems of installation and cost increase, and it also brings difficulties to later maintenance
[0003] At present, some cooling devices that can concentrate heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles for users that are difficult to maintain and difficult to install.
If the positioning is inaccurate during the installation process, it will affect the targeted heat dissipation of the cooling chip, thereby affecting the operation stability and reliability of the overall system of the circuit board

Method used

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  • Circuit board apparatus assembly with adjustable air feed speed and LED lamp
  • Circuit board apparatus assembly with adjustable air feed speed and LED lamp

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Embodiment Construction

[0009] Combine below Figure 1-2 The present invention will be described in detail.

[0010] A circuit board device assembly with adjustable air supply speed and LED lights according to an embodiment, comprising a circuit board device 12, a hinged frame 9 fixed at one end of the circuit board device 12 and connected to the hinged frame 9 The cooling plate device 2, wherein, the main body block 91 of the hinged frame 9 is provided with a vertical guide rail groove 10 and a horizontal guide rail groove 7 for respectively connecting with one end of the vertically slidable clamping positioning block 11 and the horizontally slidable One end of the clamping positioning block 5 is slidingly fitted, and the main body block 91 of the hinge frame 9 is also connected with one end of the vertical guide rod 3 wound with the vertical tension spring 4 and the horizontal tension spring 13 wound with it. One end of the guide rod 14 is fixedly connected, and the other end of the vertical guide...

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Abstract

A circuit board apparatus assembly with an adjustable air feed speed and an LED lamp comprises a circuit board apparatus (12), a hinged frame (9) fixedly arranged at one end of the circuit board apparatus (12), and a cooling plate apparatus (2) connected with the hinged frame (9); wherein a main body block (91) of the hinged frame (9) is provided with a vertical guide rail groove (10) and a horizontal guide rail groove (7) for being in sliding fit with one end of a clamping locating block (11) capable of sliding vertically and one end of a clamping locating block (5) capable of sliding horizontally respectively, and the main body block (91) of the hinged frame (9) is also fixedly connected with one end of a vertical guide rod (3) on which a vertical extension spring (4) is wound and one end of a horizontal guide rod (14) on which a horizontal extension spring (13) is wound.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a circuit board device assembly with adjustable air supply speed and LED lights. Background technique [0002] In the field of circuit boards, it is often necessary to conduct targeted heat dissipation for heat dissipating components in the circuit board, such as high-power chips. Now it is often used to install a separate cooling fan on these chips to achieve effective heat dissipation. However, this heat dissipation mode is easy to cause problems of installation and cost increase, and also brings difficulties to later maintenance. [0003] At present, some cooling devices capable of centralized heat dissipation are often difficult to locate, install, open and maintain conveniently, causing troubles that are difficult to maintain and difficult to install for users. If the positioning is not accurate during the installation process, it will affect the targeted heat dissipation of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K1/18
CPCH05K7/20145H05K1/182
Inventor 方小刚
Owner 方小刚