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Electronic equipment

A technology of electronic equipment and electronic components, which is applied in the field of electronic device packaging and protection, can solve the problems of electronic equipment strength and stiffness weakening, and achieve the effects of reducing production costs, facilitating assembly, and realizing modularization

Active Publication Date: 2016-06-01
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, reducing the thickness of the package case will lead to weakening of the strength and rigidity of the electronic device

Method used

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031] As mentioned in the background art, current electronic equipment usually achieves light and thin electronic equipment by reducing the thickness of the electronic equipment package casing. However, reducing the thickness of the packaging case will lead to weakening of the strength and rigidity of the electronic device.

[0032] Taking notebook computers as an example, the thin and light casings of notebook computers currently produced in the prior art le...

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Abstract

The embodiment of the invention discloses electronic equipment, which comprises a first panel, a shell, a frame and a plurality of electronic components, wherein the first panel and the shell are oppositely arranged; the frame and the plurality of electronic components are arranged between the panel and the shell; and the frame is fixed on the inner surface of the shell for enhancing the mechanical strength of the shell. Since the electronic equipment provided by the invention adds the frame used for enhancing the mechanical strength of the shell on the inner surface of the shell, the thinner shell can be adopted to avoid from damaging the strength and the hardness of the electronic equipment. Meanwhile, the geometric structure of the frame can be designed to cause the frame to be used for installing and fixing the plurality of electronic components, the use of fixed components including retaining screws and the like can be reduced, the modularization of electronic equipment assembling is realized, the electronic equipment can be more convenient in assembling, and manufacture cost is lowered.

Description

technical field [0001] The present invention relates to the technical field of packaging and protection of electronic devices, and more specifically, relates to an electronic device. Background technique [0002] With the continuous development of science and technology, more and more electronic devices are applied to people's daily work and life, bringing great convenience to people's daily work and life, and becoming an indispensable tool for people today. [0003] The thinning and lightening of electronic equipment is a major trend in the development of electronic equipment. Electronic devices commonly used by people today, such as mobile phones and notebooks, are designed to be thin and light to make the electronic devices easy to carry, which is the mainstream of the development of electronic devices today. [0004] At present, the thickness of the electronic equipment is usually reduced by reducing the thickness of the packaging shell of the electronic equipment. How...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16
CPCG06F1/1613G06F1/1658
Inventor 马映峰杨志峰
Owner LENOVO (BEIJING) LTD
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