Multifunctional computer case

Abstract

The invention discloses a multifunctional computer case. The computer case comprises a case body, a side case cover, a front case cover, a back case cover, a screen, a lifting handle, an optical driver, a temperature display control apparatus, castors and a starting switch, wherein an air inlet, a protective observation hole and a protective board are arranged in / on the side case cover; a power supply vibration preventing pad is arranged at the upper part of the inner side of the side case cover; a first expansion slot, a second expansion slot and a functional jack are further mounted on the front case cover between the optical driver and the starting switch in sequence; a first drawer and a second drawer are mounted in the first expansion slot and the second expansion slot respectively; pulling handles are arranged at the front ends of the first drawer and the second drawer respectively; and the temperature display control apparatus is mounted on the front case cover on the lower side of the starting switch. The computer case is simple in structure and convenient to use; the arranged drawers can collect related articles such as a U disk, a data line and the like; the computer case is high in reliability, high in heat dissipation speed, free of dust accumulation and good in effect; the service life of the computer case is prolonged; and the computer case is very user-friendly.

Description

technical field [0001] The invention relates to the technical field of computer hardware, in particular to a multifunctional computer case. Background technique [0002] At present, the use of computers is gradually popularized, used in all walks of life, and has become a necessary equipment for office use. The daily use time is very long, but after the computer is used for a period of time, the components inside the case are It will dissipate heat, which will increase the temperature in the chassis, which will affect the running speed of the computer. The current cooling of computers is to use cooling holes on the chassis to achieve the purpose of heat dissipation through automatic exchange of heat inside and outside. At present Commonly used heat sink materials are copper and aluminum alloy, both of which have their own advantages and disadvantages. Copper has good thermal conductivity, but it is more expensive, difficult to process, too heavy, has a small heat capacity, a...

AI Technical Summary

Problems solved by technology

When transporting or moving the vibrating computer, the power supply inside the chassis will collide with the side panel of the chassis to a certain extent, resulting in poor contact inside the power supply, which will bring certain hidden dangers to future use.

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