a photodetector

Abstract

The invention provides an optical detector. A reflecting layer is used for separating a semiconductor chip for emitting radiation and a plurality of semiconductor chips for detecting radiation so as to ensure the independence of emission and detection, the mutual interference is prevented, and the detection accuracy is improved; and moreover, a first cavity in a circular table shape is used for emitting a radiation signal, and the emission collimation is ensured; and an annular cavity with an inverted isosceles trapezoid cross section is used as an accommodating cavity for radiation detecting, and thus, a feedback signal can be enabled to be received to the greatest extent.

Description

technical field

[0001] The invention relates to the field of photodetection devices, in particular to a photodetection device with an injection molded housing, a radiation-emitting semiconductor chip and a radiation-detecting semiconductor chip. Background technique

[0002] It is known to design a component with a radiation-emitting semiconductor chip and a radiation-detecting semiconductor chip. However, the devices generally have semiconductor chips arranged in separate housings and spaced apart from one another, for example on a circuit board. However, the signal of the radiation-emitting semiconductor chip will affect the radiation-detecting semiconductor chip, resulting in deviation or failure of the detection result, and generally, the radiation-emitting signal is strong, while the feedback signal of the detection radiation is weak and difficult to capture. Contents of the invention

[0003] Based on solving the above-mentioned problems in the packaging, the presen...

Examples

Embodiment Construction

[0014] see figure 1 and 2 , the invention provides a photodetection device with an injection molded housing, a radiation-emitting semiconductor chip 2 and a plurality of radiation-detecting semiconductor chips 3, figure 2 4 semiconductor chips 3 are shown in , it can also be 6 or 8, etc., wherein a first cavity 4 and a second cavity 5 are formed in the injection molded housing, and the first cavity 4 is composed of an inner wall and a bottom The frustum-shaped cavity surrounded by the walls, the cross-section of the frustum-shaped cavity is an upright isosceles trapezoid, and the second cavity 5 is an annular cavity surrounded by the first cavity surrounded by the outer wall, the inner wall and the bottom wall. The section of the cavity is an inverted isosceles trapezoid; the bottom wall includes a plurality of conductive carriers 1 for carrying the radiation-emitting semiconductor chip 2 and a plurality of radiation-detecting semiconductor chips 3, a plurality of electrode ...

technical field

[0001] The invention relates to the field of photodetection devices, in particular to a photodetection device with an injection molded housing, a radiation-emitting semiconductor chip and a radiation-detecting semiconductor chip. Background technique

[0002] It is known to design a component with a radiation-emitting semiconductor chip and a radiation-detecting semiconductor chip. However, the devices generally have semiconductor chips arranged in separate housings and spaced apart from one another, for example on a circuit board. However, the signal of the radiation-emitting semiconductor chip will affect the radiation-detecting semiconductor chip, resulting in deviation or failure of the detection result, and generally, the radiation-emitting signal is strong, while the feedback signal of the detection radiation is weak and difficult to capture. Contents of the invention

[0003] Based on solving the above-mentioned problems in the packaging, the presen...

Examples

Embodiment Construction

[0014] see figure 1 and 2 , the invention provides a photodetection device with an injection molded housing, a radiation-emitting semiconductor chip 2 and a plurality of radiation-detecting semiconductor chips 3, figure 2 4 semiconductor chips 3 are shown in , it can also be 6 or 8, etc., wherein a first cavity 4 and a second cavity 5 are formed in the injection molded housing, and the first cavity 4 is composed of an inner wall and a bottom The frustum-shaped cavity surrounded by the walls, the cross-section of the frustum-shaped cavity is an upright isosceles trapezoid, and the second cavity 5 is an annular cavity surrounded by the first cavity surrounded by the outer wall, the inner wall and the bottom wall. The section of the cavity is an inverted isosceles trapezoid; the bottom wall includes a plurality of conductive carriers 1 for carrying the radiation-emitting semiconductor chip 2 and a plurality of radiation-detecting semiconductor chips 3, a plurality of electrode ...

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