Back adhesive layer, preparation method for back adhesive layer, and terminal

An adhesive layer and terminal technology, which is applied to the preparation of adhesive layer and the field of adhesive layer, can solve the problems of inability to solve the problem of laminating bubbles, complicated structure of punching die, increase of defective molding, etc., so as to reduce the processing cost, The effect of preventing assembly defects and improving yield

Inactive Publication Date: 2017-02-15
YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] (1) Air vents are added to the buffer foam of the LCD screen, but there are still air bubbles in the positions where the air vents are not opened, which cannot solve the problem of laminating air bubbles
[0004] (2) The opening of the foam, the structure of the punching knife die becomes complicated, the cost increases, and the molding failure increases

Method used

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  • Back adhesive layer, preparation method for back adhesive layer, and terminal
  • Back adhesive layer, preparation method for back adhesive layer, and terminal
  • Back adhesive layer, preparation method for back adhesive layer, and terminal

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Embodiment Construction

[0038] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0039]In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented by a third party different from the third party described here. Therefore, the protection scope of the present invention is not limited by the following disclosure. The limitations of specific examples.

[0040] figure 1 A schematic diagram of a back adhesive layer according to an embodiment of the present invention is shown.

[0041] Such as figure 1 As shown, the adhesive layer 1...

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Abstract

The invention provides a back adhesive layer, a preparation method for the back adhesive layer, and a terminal, wherein the back adhesive layer comprises a gas guide groove; the gas guide groove is arranged on a faying surface of the back adhesive layer and a terminal component; the notch of the gas guide groove is arranged at the edge tangent plane of the back adhesive layer; and the back adhesive layer discharges gas generated when a die-cutting part is fayed to the terminal component through the gas guide groove. By means of the technical scheme disclosed by the invention, the die-cutting part can be completely fayed to the terminal component; generation of bubble in a faying area can be avoided; the poor assembly due to bubbles in the faying area can be prevented; the terminal processing yield is increased; and the processing cost of manufactures is reduced.

Description

technical field [0001] The present invention relates to the technical field of terminals, in particular to a back glue layer, a method for preparing the back glue layer and a terminal. Background technique [0002] In related technologies, in order to prevent mobile phones and other terminals from falling due to the contact between the liquid crystal screen and the metal parts of the front case, buffer foam is usually added to the metal parts of the front case. Bubbles will be generated during the pasting process, resulting in poor manufacturing process. Although there are some solutions for real bubble temperature, the existing solutions still have the following defects: [0003] (1) Air vents are added to the buffer foam of the LCD screen, but there are still air bubbles in the position where the air vents are not opened, which cannot solve the problem of laminating air bubbles. [0004] (2) Foam opening, punching die structure becomes complex, cost increases, and poor mo...

Claims

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Application Information

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IPC IPC(8): H05K5/02
CPCH05K5/0217
Inventor任小小刘荣华
OwnerYULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD