Connection device and manufacturing method thereof

A connection device and connector technology, applied in the field of electronics, can solve the problems of low SI quality, and achieve the effects of improving SI quality and reducing crosstalk noise.

Inactive Publication Date: 2017-05-31
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Through SI theoretical analysis and simulation verification, it is found that based on the connection scheme of the connector in the prior art on the circuit board, the SI quality during signal transmission is low

Method used

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  • Connection device and manufacturing method thereof
  • Connection device and manufacturing method thereof
  • Connection device and manufacturing method thereof

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Embodiment Construction

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

[0036] Such as figure 1 As shown, the embodiment of the present invention provides a connection device, including:

[0037] circuit board 101 and connector 102;

[0038] The connector is arranged on the circuit board, and the connector is located on the component mounting layer of the circuit board;

[0039] The ground trace on the circuit board conn...

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Abstract

The invention provides a connection device and a manufacturing method thereof. The connection device comprises a circuit board and a connector, wherein the connector is arranged on the circuit board; the connector is located on a component installation layer of the circuit board; a grounding trace, connected with a ground layer of the circuit board, on the circuit board surrounds a signal transmission pin of the connector to form a loop on the component installation layer; and the loop surrounds the signal transmission pin. According to the connection device and the manufacturing method thereof, the quality of SI during signal transmission can be improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a connection device and a manufacturing method thereof. Background technique [0002] When designing server products, the routing rate of system interconnection signals is gradually increasing. At present, products with a rate of 25Gbps to 100Gbps have been developed and designed successively. On the circuit board, as the signal rate increases, how to ensure the quality of SI (Signal Integrity, signal integrity) during signal transmission becomes more and more important. [0003] In the prior art, on the circuit board where the connector is located, one end is drawn for each GND pin of the connector, connected to the GND via hole, and connected to the GND layer of the circuit board through the GND via hole. High-speed signal transmission backflow provides a path. [0004] Through SI theoretical analysis and simulation verification, it is found that based on the connection s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0219H05K1/18H05K2201/09218
Inventor 武宁
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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