Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Connection device and manufacturing method thereof

A connection device and connector technology, applied in the field of electronics, can solve the problems of low SI quality, and achieve the effects of improving SI quality and reducing crosstalk noise.

Inactive Publication Date: 2017-05-31
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Through SI theoretical analysis and simulation verification, it is found that based on the connection scheme of the connector in the prior art on the circuit board, the SI quality during signal transmission is low

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Connection device and manufacturing method thereof
  • Connection device and manufacturing method thereof
  • Connection device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection of the present invention. scope.

[0036] Such as figure 1 As shown, the embodiment of the present invention provides a connection device, including:

[0037] circuit board 101 and connector 102;

[0038] The connector is arranged on the circuit board, and the connector is located on the component mounting layer of the circuit board;

[0039] The ground trace on the circuit board conn...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a connection device and a manufacturing method thereof. The connection device comprises a circuit board and a connector, wherein the connector is arranged on the circuit board; the connector is located on a component installation layer of the circuit board; a grounding trace, connected with a ground layer of the circuit board, on the circuit board surrounds a signal transmission pin of the connector to form a loop on the component installation layer; and the loop surrounds the signal transmission pin. According to the connection device and the manufacturing method thereof, the quality of SI during signal transmission can be improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a connection device and a manufacturing method thereof. Background technique [0002] When designing server products, the routing rate of system interconnection signals is gradually increasing. At present, products with a rate of 25Gbps to 100Gbps have been developed and designed successively. On the circuit board, as the signal rate increases, how to ensure the quality of SI (Signal Integrity, signal integrity) during signal transmission becomes more and more important. [0003] In the prior art, on the circuit board where the connector is located, one end is drawn for each GND pin of the connector, connected to the GND via hole, and connected to the GND layer of the circuit board through the GND via hole. High-speed signal transmission backflow provides a path. [0004] Through SI theoretical analysis and simulation verification, it is found that based on the connection s...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18
CPCH05K1/0219H05K1/18H05K2201/09218
Inventor 武宁
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com