A kind of coolant for wire cutting and a kind of coolant and application thereof

A coolant and wire cutting technology, applied in lubricating compositions, petroleum industry, etc., can solve problems such as easy damage of diamond wire, affecting cutting effect, unsatisfactory cooling effect, etc.

Active Publication Date: 2020-09-01
江苏乐美新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although the cutting efficiency of the water-based diamond wire multi-wire cutting method is fast, the cooling effect is not ideal. The diamond wire is easily damaged during the cutting process, which affects the cutting effect and causes the cutting surface of the silicon wafer to be uneven.

Method used

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  • A kind of coolant for wire cutting and a kind of coolant and application thereof
  • A kind of coolant for wire cutting and a kind of coolant and application thereof
  • A kind of coolant for wire cutting and a kind of coolant and application thereof

Examples

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preparation example Construction

[0033] The preparation method of the coolant for wire cutting is not particularly limited in the present invention, and the preparation method of the composition well-known to those skilled in the art can be adopted, and the components can be mixed; preferably, the coolant for wire cutting described in the above technical solution The components of the coolant are mixed to obtain a coolant for wire cutting. In the present invention, there is no special requirement on the mixing method, and those well-known by those skilled in the art can be used. In the present invention, the mixing is preferably performed under stirring conditions. The present invention has no special requirements on the specific implementation of the stirring, as long as the components can be uniformly mixed.

[0034] In the present invention, after mixing the raw material components, the mixed material is preferably filtered to remove impurities in the mixed material and avoid the influence of impurities o...

Embodiment 1

[0044] In parts by mass, 70 parts of BASF LF403, 20 parts of polyethylene glycol monooleate, 2 parts of hydrolyzed polymaleic anhydride, 2 parts of coconut oil diethanolamide and 6 parts of Efka 2022 were mixed to obtain coolant.

[0045] The obtained coolant for wire cutting is a colorless, transparent liquid. Mix the coolant for wire cutting in this embodiment with water according to the mass ratio of 1:200, let it stand for 30s, and observe its defoaming performance, such as figure 1 shown by figure 1 It can be seen that after the coolant for wire cutting in this embodiment is mixed with water for 30 seconds, the foam disappears, indicating that the product of the present invention has excellent defoaming performance and is beneficial to the delivery of coolant.

[0046] The wire cutting coolant obtained above is mixed with water according to a mass ratio of 1:400 to obtain a coolant for diamond wire cutting, which is used for cooling during diamond wire cutting of silico...

Embodiment 2

[0050] According to parts by mass, add 70 parts of BASF XL70, 18 parts of BASF LF221, 77 parts of polyethylene glycol monooleate, 2 parts of hydrolyzed polymaleic anhydride, 2 parts of fatty alcohol diethanolamide and 6 parts of Efka 2022 Mix to obtain a coolant for wire cutting.

[0051] The preparation method is the same as that in Example 1, except that after mixing, the mixture is filtered to obtain a coolant for wire cutting. Mix the coolant of this example with water at a mass ratio of 1:300.

[0052] The silicon wafer was cut according to the method in Example 1, and the yield of the silicon wafer reached 95%.

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Abstract

The invention belongs to the technical field of wire-electrode cutting, and particularly provides a coolant for wire-electrode cutting which comprises the following components in parts by weight: 5-90parts of a nonionic surfactant, 5-80 parts of an ester lubricant, 0.1-10 parts of a defoamer, 0.5-5 parts of a corrosion inhibitor and 0.5-5 parts of a dispersant. The invention also provides coolingliquid and application thereof in online cutting silicon crystal blocks. The cooling liquid provided by the invention has relatively good wear-reducing, cleaning, defoaming and settling properties.

Description

technical field [0001] The invention belongs to the technical field of wire cutting, and in particular relates to a cutting coolant, a cooling liquid and applications thereof. Background technique [0002] At present, silicon wafers used in the photovoltaic industry are mainly obtained by cutting silicon crystal blocks. The traditional cutting method of silicon crystal blocks is to carry silicon carbide through polyethylene glycol to grind silicon crystal blocks. This method requires a long cutting time and will have a certain impact on the environment; later, water-based steel wire multi-wire cutting With its high efficiency, the technology has gradually replaced the silicon carbide grinding method carried by polyethylene glycol. This method uses the unidirectional circulation or reciprocating circulation of the diamond wire to form a relative grinding motion between the diamond wire and the object to be cut, thereby To achieve the purpose of cutting, water is used as the ...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C10M173/02C10N30/06C10N30/18
CPCC10M173/02C10M2209/086C10M2209/104C10M2209/109C10M2215/042C10M2229/02C10N2030/06C10N2030/18
Inventor刘欢欢
Owner江苏乐美新材料科技有限公司