Post-curable precursor of acrylic-based pressure-sensitive adhesive

Abstract

The present disclosure is directed to a curable precursor of a pressure-sensitive adhesive comprising: a) a (co)polymeric material comprising the reaction product of a (co)polymerizable material comprising a (meth)acrylate ester monomer; and optionally, a co-monomer having an ethylenically unsaturated group; b) a polyfunctional aziridine curing agent; c) a thermal acid generating agent; and d) magnetic particles. The present disclosure is also directed to a method of applying such pressure-sensitive adhesives to a substrate and uses thereof.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from EP patent application 15194889.0 filed on November 17, 2015, the disclosure of which is hereby incorporated by reference in its entirety. technical field [0003] This disclosure relates generally to the field of adhesives, and more particularly to the field of pressure sensitive adhesives (PSAs). The present disclosure also relates to methods of applying such pressure sensitive adhesives and uses thereof. Background technique [0004] Adhesives have been used for a variety of marking, securing, protecting, sealing and masking purposes. Adhesive tapes generally include a backing or substrate and an adhesive. One type of adhesive that is particularly preferred for many applications is represented by pressure sensitive adhesives. [0005] In fact, pressure sensitive tape is ubiquitous in homes and workplaces. In its simplest configuration, a pressure sensitive tape includes an a...

AI Technical Summary

Problems solved by technology

However, the moisture sensitivity of these known systems is not as expected because of the decomposition of superacids required for UV-induced cationic curing or crosslinking of the epoxy functionality to hydronium ions, rendering the epoxy resin unable to undergo ring-opening polymerization.

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