Cutting matrix for Platanus
A technology for cutting substrate and sycamore, applied in planting substrate, culture medium, horticulture, etc., can solve the problem of low survival rate, and achieve the effects of comprehensive nutrition, not easy to grow mildew and bacteria, and not easy to breed bacteria.
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Embodiment 1
[0010] A syringa cutting substrate, which consists of the following components in parts by mass: 40 parts of black soil, 15 parts of modified vermiculite, 15 parts of bentonite, 20 parts of sandy loam, 7 parts of vermicompost, 8 parts of locust dung, and 6 parts of waste fungus stick 2 parts, 2 parts of arrow poison wood rhizome, 20 parts of coconut peat.
Embodiment 2
[0012] A sycamore cutting substrate, which consists of the following components in parts by mass: 30 parts of black soil, 10 parts of modified vermiculite, 10 parts of bentonite, 15 parts of sandy loam soil, 5 parts of vermicompost, 5 parts of locust dung, and 4 parts of waste fungus sticks 1 part, 1 part of curare wood rhizome, 15 parts of coconut peat.
Embodiment 3
[0014] A sycamore cutting substrate, which is composed of the following components in parts by mass: 50 parts of black soil, 20 parts of modified vermiculite, 20 parts of bentonite, 25 parts of sandy loam, 10 parts of vermicompost, 10 parts of locust dung, and 8 parts of waste fungus sticks 3 parts, 3 parts of arrow poison wood rhizome, 25 parts of coconut peat.
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