Stick-type hot-melt adhesive body for hot-melt glue guns

Abstract

The present invention relates to a stick-type hot-melt adhesive body for use in hot-melt glue guns, the hot-melt adhesive body having at least one first section containing at least one reactive adhesive or consisting thereof and at least one second section containing at least one cleaning agent (purging agent) or consisting thereof, the first section and / or the reactive hot-melt adhesive on the one hand and the second section and / or the cleaning agent on the other hand differing optically and / or visually from one another, in particular being of different colours.

Description

technical field [0001] The present invention relates to the technical field of hot-melt adhesives and their use in corresponding assembly or gluing procedures, and also to the technical field of hot-melt adhesive ejection devices, in particular in the form of hot-melt or hot-glue guns, as applied herein . [0002] The invention relates in particular to stick-type (rod-shaped, stick-shaped) hot-melt adhesive bodies, especially hot-melt adhesive sticks, which are based on reactive hot-melt adhesives and cleaning or removal agents, hot-melt adhesives The body is preferably in the form of a cylinder and is especially suitable for hot melt glue guns. [0003] The invention likewise relates to a method for producing a hot-melt adhesive body according to the invention, in particular a hot-melt adhesive stick, and also to the adhesive body obtained by this method. [0004] Furthermore, the invention relates to a hot-melt adhesive discharge device (hot-melt adhesive processing device...

AI Technical Summary

Problems solved by technology

[0028] In this context, however, reactive hotmelt adhesives are problematic in their storage and processing, especially in hotmelt guns, because on the one hand, for example, with (atmospheric) moisture or (environmental ) excessive exposure to radiation, leading to an undesired premature reaction of the chemically reactive groups of the hot melt adhesive

On the other hand, in the case of processing in hot-melt glue guns, reactive hot-melt adhesives which have previously been melted and which in particular remain in the area of ​​the heating or melting device as well as the discharge device (especially the adhesive nozzle) , can undergo (thermally) irreversible curing during pauses or stops in operation, and in doing so, can form a chemical adhesive bond with the inner surface of the hot melt glue gun in contact with the reactive hot melt adhesive, which This bond cannot be separated even by subsequent heating; therefore, this leads to an undesired clogging of the glue gun, which cannot be removed even by heating

[0029] The above-mentioned reactive hotmelt adhesives are disadvantageous in terms of processing properties in corresponding hotmelt adhesive application devices (such as hotmelt glue guns, etc.), because after corresponding application of corresponding equipment and adhesive After the compound has cured, they cannot be easily removed from the unit

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