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Heat-pipe-based enhanced radiating mobile phone sleeve

A mobile phone cover and heat pipe technology, which is applied to the structure of the phone, modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve temperature rise, mobile phone heat accumulation, mobile phone cover thermal conductivity and surface heat transfer performance To achieve the effect of increasing the surface area of ​​heat exchange, avoiding the accumulation of heat, and enhancing the effect of convective heat exchange

Pending Publication Date: 2019-01-04
SOUTH CHINA UNIV OF TECH
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, most of the heat generated by the mobile phone during use enters the environment through the radiation and convective heat transfer of the mobile phone back case. After the user installs the mobile phone case, the heat dissipation effect of the mobile phone rear case is greatly weakened by the blocking of the mobile phone case. Moreover, the thermal conductivity and surface heat transfer performance of the mobile phone case itself are often poor, so it is easy to cause heat accumulation and temperature rise of the mobile phone, affecting the performance and user experience of the mobile phone

Method used

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  • Heat-pipe-based enhanced radiating mobile phone sleeve
  • Heat-pipe-based enhanced radiating mobile phone sleeve
  • Heat-pipe-based enhanced radiating mobile phone sleeve

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Embodiment Construction

[0021] In order to further understand the present invention, the preferred embodiments of the present invention are described below in conjunction with examples, but it should be understood that these descriptions are only to further illustrate the features and advantages of the present invention, rather than limiting the claims of the present invention.

[0022] see figure 1 , figure 2 , image 3 with Figure 4 , a mobile phone case with enhanced heat dissipation based on heat pipes, which is used to cover the outside of a mobile phone, including a mobile phone case 1, a heat pipe 5 and a heat-conducting silicone pad 6. The mobile phone case 1 is box-shaped, and its appearance matches the mobile phone. The mobile phone case 1. The material can be heat-conducting plastic, heat-conducting silica gel, metal, etc., which is not limited here, but it should be ensured that the material has good heat-conducting performance. Groove 2, heat pipe 5 and mobile phone back shell, the ...

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Abstract

The invention discloses a heat-pipe-based enhanced radiating mobile phone sleeve which is used for sleeving the exterior of the mobile phone and comprises a thermally conductive mobile phone sleeve case and heat pipes, wherein the heat pipes are uniformly embedded on the inner bottom surface of the mobile phone sleeve case. The inner bottom surface is uniformly provided with grooves for embeddingthe heat pipes. The bottom of the groove is provided with an elastic heat conduction pad. The invention provides the heat-pipe-based enhanced radiating mobile phone sleeve, wherein the process is simple, the mobile phone still has a good heat dissipation path after the mobile phone sleeve is installed, and heat accumulation is avoided.

Description

technical field [0001] The invention relates to the field of mobile phone accessories, in particular to a heat pipe-based enhanced heat dissipation mobile phone case. Background technique [0002] With the advancement of science and technology, mobile phones have increasingly become a necessity in people's lives, and the annual sales of mobile phones are also showing a growing trend. In order to protect their mobile phones, users often install mobile phone cases outside the mobile phone to reduce the damage caused to the mobile phone due to accidents such as dropping. However, most of the heat generated by the mobile phone during use enters the environment through the radiation and convective heat transfer of the mobile phone back case. After the user installs the mobile phone case, the heat dissipation effect of the mobile phone rear case is greatly weakened by the blocking of the mobile phone case. Moreover, the thermal conductivity and surface heat transfer performance o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/18H05K7/20
CPCH04M1/18H05K7/2039
Inventor 袁伟杨阳王淳袁宇航叶胤桐王祺周宇航钟育坚汤勇
Owner SOUTH CHINA UNIV OF TECH
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