Thermal removal method and system for PCIE equipment and related device

A heat removal and equipment technology, applied in the server field, can solve the problem of low server maintenance efficiency and achieve the effect of improving heat removal efficiency

Pending Publication Date: 2019-04-23
GUANGDONG INSPUR BIG DATA RES CO LTD
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  • Abstract
  • Description
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Problems solved by technology

[0003] The purpose of this application is to provide a method and system for hot removal of PCIE devices, a computer-readable storage m

Method used

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  • Thermal removal method and system for PCIE equipment and related device
  • Thermal removal method and system for PCIE equipment and related device

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Embodiment Construction

[0035] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0036] Please refer to figure 1 , figure 1 It is a flowchart of a thermal removal method of a PCIE device provided in the embodiment of the present application, the thermal removal method includes:

[0037] S101: After receiving the power-off command of the PCIE device, set the first GPIO in the PCH to a low level;

[0038] This step is to receive ...

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Abstract

A thermal removal method of the PCIE equipment comprises the steps that after a power-off instruction of the PCIE device is received, a first GPIO in a PCH is set to be a low level; when it is detected that the first GPIO is at a low level, ACPI Hotplug interruption is triggered; when the ACPI Hotplug interruption occurs, the occupied resources of the PCIE equipment are released; and when the release of the occupied resources of the PCIE device is finished, a removal instruction is generated so as to remove the PCIE equipment. In the whole thermal removal process, only the power-off instruction needs to be sent to the server, when thermal removal of the PCIE devices is carried out in batches, the thermal removal efficiency of the PCIE devices is greatly improved, and the maintenance of a server cluster is facilitated. The invention also provides a thermal removal system of the PCIE equipment, a computer readable storage medium and a server, which have the above beneficial effects.

Description

technical field [0001] The present application relates to the field of servers, in particular to a method, system and related devices for heat removal of PCIE equipment. Background technique [0002] In the field of server motherboards, the PCIE interface supports the hot removal function of the device. At present, there are technologies that realize this operation, that is, the PCIE device can be safely removed in the power-on state without causing server abnormalities. However, the current technology is to establish On the basis of complex hardware circuits, the need to increase the heat removal control circuit, the power indicator light and the prompt button greatly increase the complexity of the operation, and the process from pressing the remove button to prompting that the device can be removed also requires Waiting time, when a large number of servers in the computer room need to hot-remove certain PCIE devices, maintenance personnel need to do this for each one in tu...

Claims

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Application Information

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IPC IPC(8): G06F13/40
CPCG06F13/4081G06F2213/0026Y02D10/00
Inventor 翟庆伟
Owner GUANGDONG INSPUR BIG DATA RES CO LTD
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