A method for measuring the size of a disc
A measurement method and wafer technology, applied to measuring devices, instruments, optical devices, etc., can solve problems such as difficulty in guaranteeing, deviations in wafer thickness measurement, and unreported automatic ultra-thin wafer measurement methods.
Inactive Publication Date: 2020-11-24
INST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS
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Problems solved by technology
[0002] In engineering projects, it sometimes involves the measurement of the thickness and diameter of various ultra-thin wafers, including wafers with large differences in special geometric dimensions. Ultra-thin wafers are light in weight, easy to float, thin in thickness, and Easy to bend and deform, easy to float makes the thickness measurement of the wafer deviate, and easy to bend and deform makes it difficult to guarantee the accuracy of diameter measurement
[0003] At present, the thickness of ultra-thin wafers is often measured one by one with a spiral micrometer, which takes a long time. The diameter of the wafer is measured by overlapping multiple wafers of the same type to increase the thickness. Calipers and other tools are used to measure, and the measurement accuracy is difficult to guarantee. Automatic measurement of various ultra-thin wafers that cannot be used in automated production lines
[0004] Currently, no automatic measurement method for various ultra-thin wafers has been reported
Method used
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Embodiment 1
[0053] Such as Figure 8 As shown, the measuring method of the present embodiment comprises the following steps:
[0054] a. If figure 2 As shown, the wafer 1 area of the tray is divided into A, the wafer 2 area is divided into B, the small wafer 1 area is divided into C, and the small wafer 2 area is divided into D; for the measurement of different wafers, define the inter-module The transmission format of the measurement data is X+i / j, where X is one of A, B, C or D, indicating that the wafer in row i and column j of the corresponding area is measured;
[0055] b. After the robot 5 receives the measurement data, it extracts, analyzes and processes the measurement data, and drives the vacuum suction head I 401 of the mechanical gripper 4 to move to the i-th row and j-th column of the X area of the pallet. If X is A or B , turn on the vacuum generator III411, if X is C or D, turn on the vacuum generator IV412, if X is other values, the system will alarm and display that...
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The present invention discloses a wafer size measuring method. The measuring method utilizes a robot to drive a mechanical gripper to move a vacuum suction head to a corresponding suction station according to a received measuring signal and to suck an ultra-thin wafer; secondly, the robot drives the wafer sucked to a photographing station, after a photographing mechanism extracts inner and outer diameters and a center of a circle according to different types, feeds back data to the robot, and the robot adjusts a coordinate system according to the center information to place to the measuring station; and the measuring mechanism completes thickness measurement of the wafer and feeds the data back to the robot, the robot determines the measured thickness, and finally draws the wafer at the measuring station to automatically return to a corresponding position of a tray according to a return method. The wafer size measuring method has the advantages of automation, high efficiency and intelligence, and can be used for industrial promotion.
Description
technical field [0001] The invention belongs to the technical field of automatic measurement, and in particular relates to a method for measuring the size of a wafer. Background technique [0002] In engineering projects, it sometimes involves the measurement of the thickness and diameter of various ultra-thin wafers, including wafers with large differences in special geometric dimensions. Ultra-thin wafers are light in weight, easy to float, thin in thickness, and The characteristics of easy bending and deformation, easy to float make the thickness measurement of the wafer deviate, and the characteristics of easy bending and deformation make it difficult to guarantee the accuracy of diameter measurement. [0003] At present, the thickness of ultra-thin wafers is often measured one by one with a spiral micrometer, which takes a long time. The diameter of the wafer is measured by overlapping multiple wafers of the same type to increase the thickness. Calipers and other tools ...
Claims
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IPC IPC(8): G01B11/00G01B11/06G01B11/08
CPCG01B11/00G01B11/06G01B11/08
Inventor任旭程焰林刘仁涛李正林陈聪梁莉
OwnerINST OF ELECTRONICS ENG CHINA ACAD OF ENG PHYSICS