Chip heat exchanger and inverter air conditioner

Abstract

Disclosed are a chip heat exchanger and an inverter air conditioner. The chip heat exchanger comprises a heat pipe (5), an inflation plate condenser (4) and a capillary tube (3), wherein an evaporation section (51) of the heat pipe (5) is arranged below a chip (2) of an air conditioner computer board (1); a condensation section (52) of the heat pipe (5) is connected to the evaporation section (51) via the capillary tube (3); and the condensation section (52) is connected to the inflation plate condenser (4). In this way, the circulation power of a refrigerant can be improved, the heat absorption quantity of the evaporation section can be increased, and the operation temperature of the chip can be lowered.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation, in particular to a chip heat exchanger and an inverter air conditioner. Background technique [0002] At present, under the high temperature environment in summer, the chip of the inverter air conditioner computer board has poor heat dissipation, which leads to slow and difficult cooling frequency increase, error-prone control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users. T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) When the temperature becomes smaller, the heat dissipation power becomes smaller, and even computer boards are burned, the system goes down, and hardware failures occur. Contents of the invention [0003] The embodimen...

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Problems solved by technology

[0002] At present, under the high temperature environment in summer, the chip of the computer board of the inverter air conditioner has poor heat dissipation, which leads to slow and difficult frequency increase of cooling, easy error reporting of control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users

T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) become smaller, the heat dissipation power becomes smaller, and even the computer board is burned, the system is down, and the hardware failure is caused.

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