Display panel, manufacturing method thereof, and display device

A technology for a display panel and a manufacturing method, applied in nonlinear optics, instruments, optics, etc., can solve the problems of high contact resistance, insufficient adhesion, poor appearance, etc., to increase the contact area, increase the coating space, The effect of avoiding glue overflow problem
CN110764323AInactive Publication Date: 2020-02-07SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
Publication Date
2020-02-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a display panel, a manufacturing method thereof, and a display device. The display panel includes a first substrate, a second substrate, and a flip-chip film; the first substrate is provided with a first short side surface; the second substrate is arranged opposite to the first substrate, and the second substrate is provided with a second short side surface flush with the first short side surface; and the flip-chip film is bound to the first short side surface and the second short side surface; wherein the second short side surface of the second substrate forms a firstangle [Alpha] with the lower surface of the second substrate, and [Alpha] is greater than 1 degree and less than 60 degrees. According to the embodiment of the invention, by adopting an oblique edgingmethod, the cross-sectional area of a metal pin is increased, and the side-bound contact resistance is reduced; the glue filling and coating space is increased, and the amount of filling glue is increased, therefore, the problem of glue overflow caused by small space is avoided; the contact area between the filling glue and the glass substrate is increased, therefore, the adhesion force is enhanced; and meanwhile, the filling glue forms protrusions and jams the glass substrate, so that the frame and the glass substrate is more firmly bonded.
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Description

technical field

[0001] The invention relates to the field of display technology, in particular to a display panel, a manufacturing method thereof, and a display device. Background technique

[0002] Thin film transistor liquid crystal display (TFT-LCD) mostly uses Outer Lead Bonding (OLB), and the upper and lower glass substrates are staggered by a non-cut design to expose the TFT pins for driver integration. The circuit (Integrated Circuit, IC) inputs the driving signal to the panel. The method of connecting the driver IC is to first bind one end of the chip on film (Chip On Film, COF) to the metal pin (bonding lead) of the TFT glass, and the other end of the COF to the printed circuit board (Printed Circuit Board, PCB) Crimp. Anisotropic Conductive Film (ACF) is usually used as an adhesive between components to achieve fixation and conduction.

[0003] The exposed pins in the OLB area increase the frame width of the whole machine and affect the appearance. In order to ...

Claims

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