52results about How to "Solve the glue overflow problem" patented technology

The invention provides a glue laminating process. The glue laminating process comprises the following steps: (1) providing a first substrate and a second substrate; (2) dispensing a glue to the first substrate and / or the second substrate; (3) carrying out aligned press-fitting on the first substrate and the second substrate, and meanwhile, curing the periphery of the first substrate and / or the second substrate so as to obtain a semifinished product with a periphery-cured frame; and (4) carrying out surface-dressing curing on the semifinished product with the periphery-cured frame, thereby obtaining a finished product. According to the glue laminating process, the periphery of the substrates is cured while the aligned press-fitting of the substrates is completed so as to obtain the periphery-cured frame, thus, the problem of glue overflowing is effectively solved, the width of overflowed glue can be accurately controlled, the broadening of the glue does not occur after curing, secondary misalignment does not occur after curing, the accuracy of press-fitting is further improved, and the actual operation of a production line is facilitated; and the problem of press-fit bubbles can be effectively solved, the leveling of the glue is accelerated, the production time is shortened, and the production efficiency is further increased.

The invention provides a display panel and a spliced screen. The display panel comprises a display area and a binding area located on one side of the display area. The display panel also comprises a binding bonding pad which is arranged in the binding area, a retaining wall which is arranged on one side, close to the boundary of the display panel, of the binding bonding pad; and a chip-on-film which is bound on the binding bonding pad through a conductive adhesive; wherein a signal line of the display area is electrically connected with the binding bonding pad; and the boundary of the conductive adhesive is located on the side, close to the display area, of the retaining wall. According to the invention, the retaining wall is arranged on the edge of the display panel, so that the problem of conductive adhesive overflowing caused by the binding of the chip-on-film and the display panel is prevented, the frame width of the display panel is reduced, and the display effect of the spliced screen is improved.

The invention discloses an extrusion connecting device for a non-flaring guide tube connector. The extrusion connecting device comprises a hydraulic system, a clamping mechanism, a stretching mechanism, an anvil mould, semi-female moulds and a pull rod assembly, wherein an adapter head driven by the stretching mechanism is connected to the pull rod assembly; the anvil mould is detachably fixed onto a base foundation through an anvil mould base; the anvil mould is provided with cylindrical mould cavity structures which are sequentially arranged and are provided with four-grade diameters; the semi-female moulds are symmetrical structures which are formed by combining two semicircular rings, and are detachably mounted and fixed in clamping arm half holes of a clamping mechanism for clamping and fixing the guide tube connector during closing; and a mould closing gap is formed in a combined part while the two half circular rings are combined to clamp and fix the guide tube connector. The extrusion connecting device can effectively reduce labor intensity of an operator, can achieve self-adaptive clamping for dimension difference of different workpieces of the same theoretical specification, and can overcome the gap glue overflow problem of the pull rod and the inner diameter of the guide rod, so that quality of produced products is improved, the problem that mould is troublesome to replace is solved, and processing efficiency is improved.

The invention discloses a cofferdam type water-glue bonding process, which includes the following steps: A. Place the bound functional glass sheet on a bonding platform, set the amount of glue dispensed, and place the glass sheet with automatic initial curing function The glue is uniformly dotted around the functional glass sheet. B. Stand still for 3-5 minutes for the functional glass sheet that has passed through the cofferdam in step A, set the amount of glue dispensed, and apply glue for bonding to the center of the functional glass sheet. C. Lay the glass cover plate with the functional glass sheet, and then fully cure the leveled water glue. Compared with the traditional water-glue bonding process, the present invention puts a layer of glue that can be automatically initially cured but will not be fully cured without treatment on the periphery of the bonding frame, and then the water-glue dispensing, bonding, and curing are carried out. , can effectively prevent glue overflow, effectively solve the problem of glue overflow, and improve the bonding yield.

The invention provides a wafer bonding and packaging method of a silicon-based OLED. The method comprises the following steps 1, coating a silicon-based substrate with a structural adhesive by using asilk-screen printing technology; 2, uniformly coating the silicon-based substrate with an optical transparent adhesive by adopting an adhesive dispensing needle; and 3, after the optical transparentadhesive is leveled and defoamed, attaching a glass cover plate to the silicon-based substrate. According to the packaging method, the gluing time can be greatly shortened, and the problem of glue overflowing can be effectively solved.

The invention discloses a sound production device and electronic equipment, the sound production device comprises a shell, a magnetic circuit system and a vibration system, the shell is provided with a containing cavity, the magnetic circuit system is arranged in the containing cavity, the vibration system comprises a vibrating diaphragm arranged opposite to the magnetic circuit system, the vibrating diaphragm comprises a central part, a folding ring part arranged around the central part and a fixing part connected to the outer side of the folding ring part, the fixing part is connected with the shell, a glue containing groove is formed in the side, facing the shell, of the fixing part, and the side, back to the shell, of the fixing part is arranged in a plane mode. The sound production device aims to solve the problem of glue overflow between the vibrating diaphragm and the shell and prevent the glue from overflowing to extrude the vibrating diaphragm, so that polarization caused by glue overflow is effectively inhibited, and the reliability of a product is improved.

The invention discloses a dispensing head for LED solid crystal. The dispensing head for LED solid crystal comprises a pneumatic mechanism and a glue supply mechanism, the glue supply mechanism is located below the pneumatic mechanism, the pneumatic mechanism drives the glue supply mechanism, the glue supply mechanism comprises two glue supply structures in a mirror image mode, the glue supply structures are fixed to the lower part of the pneumatic mechanism, and the glue supply structures comprise connecting rods, glue supply pipes and extruders. The glue supply pipes are fixed to the lower part of the pneumatic mechanism through the connecting rods, the shape of the glue supply pipes is an L shape, the extruders are arranged on the lower end parts of the glue supply pipes, and the upperend parts of the glue supply pipes are connected with the glue body supply device. The invention further discloses a dispensing method of the LED solid crystal. According to the dispensing head of theLED solid crystal and the dispensing method for LED solid crystal, the problem of chip excessive glue of a traditional dispensing mode can be effectively solved, so that an LED chip is stably attached to a base plate, the efficiency of electric conduction and heat dissipation is better, and the reliability is higher.

The invention discloses a sounding device and an electronic terminal. The sounding device comprises a front cover and a shell which are combined together; a vibrating diaphragm is installed in a cavity defined by the front cover and the outer shell, an elastic sealing piece is integrally combined on the front cover, a step structure matched with the front cover and the outer shell is formed on theassembling face of the front cover and the outer shell, at least one gluing area is arranged on the step structure, the gluing area is configured to be used for containing glue, and the front cover and the outer shell are bonded and fixed through the glue. The sounding device not only has good sealing performance, but also is simple in assembly process; meanwhile, the drawing force of the front cover and the shell is improved in a gluing mode, the combination firmness degree of the front cover and the shell can be effectively enhanced, and glue overflowing is prevented.

The invention relates to a double sided adhesive tape processing method without adhesive overflow. The process method comprises the following steps: (1) processing a double sided adhesive tape, namely refrigerating for more than 2 hours at a temperature of 0-5 C degree; (2) designing a mold, namely compensating the product dimension and preserving adhesive overflow space; (3) selecting materials; and (4) selecting a device, wherein the sleeve cutting of a circular cutter needs to be controlled within being - / +0.10mm, the circular cutter is high in sleeve cutting precision and stable in performance; the sleeve cutting state during processing needs relatively greatly attention, so that the offsetting of the sleeve cutting can be spotted and the mold can be adjusted in time. According to the double sided adhesive tape processing method, no adhesive overflow occurs during the mold cutting of the double sided adhesive tape; after being delivered, the double sided adhesive tape can be stored at the room temperature at a client; the occurrence that normal surface mounting cannot be carried out due to adhesive overflow during automatic surface mounting in a production line is avoided; the problem of the adhesive overflow of the double sided adhesive tape is ingeniously solved; when the client carries out automatic surface mounting, the problem that a production is boned on a suction nozzle and the surface mounting cannot be carried out due to adhesive overflow never come up again.

Embodiments of the present invention provide an electromagnetic shielding module packaging structure and an electromagnetic shielding module packaging method, which relate to the technical field of semiconductor packaging. The electromagnetic shielding module packaging structure includes a module substrate, a chip, a partitioned shielding device, and a protective plastic body. And the metal shielding layer, the partition shielding device includes a shielding plastic package and a plurality of conductive arcs arranged in the shielding plastic package, electromagnetic shielding is realized by setting the partition shielding device, no need to dispense glue, and at the same time, the plastic package is opened for accommodating chips. By giving way to the groove, and by implementing the electromagnetic shielding function in the plurality of conductive arcs, the conductive arcs can be made lower than the prior art, thereby reducing the design space of the substrate surface. Compared with the prior art, the electromagnetic shielding module package structure provided by the present invention can avoid the problem of glue overflow caused by glue dispensing, and has a simple assembly process, high efficiency, and a small design space on the surface of the substrate, which reduces the thickness of the device, and has advantages. Conducive to the miniaturization of devices.

Provided are a semiconductor packaging structure and a heat dissipation member thereof. The semiconductor packaging structure comprises a bearing member having a semiconductor assembly and a heat dissipation member so that an accommodation space is formed between the heat dissipation member and the bearing member to make the semiconductor assembly positioned in the accommodation space. The heat dissipation member has a guide channel which is provided with a through hole and a recessed structure. The though hole is communicated with the accommodation space. The recesses structure is connected with a hole wall of the through hole, such that if a packaging rubber body is formed in the accommodation space and the recessed structure to wrap the semiconductor assembly, excessive glue is prevented from flowing around the through hole, and the heat dissipation efficiency can be improved.