Electromagnetic shielding module packaging structure and electromagnetic shielding module packaging method
A technology of electromagnetic shielding and packaging structure, applied in circuits, electrical components, electrical solid devices, etc., can solve the problems of increasing the design space of the substrate surface, unfavorable device miniaturization, and unfavorable high-efficiency placement, avoiding the problem of glue overflow, and facilitating The effect of miniaturization and reduction of design space
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no. 1 example
[0045] Please refer to Figure 1 to Figure 3, this embodiment provides an electromagnetic shielding module packaging structure 100, which has a good electromagnetic shielding effect and can avoid the problem of glue overflow caused by dispensing, and the assembly process is simple, the efficiency is high, and the design space of the substrate surface is small, reducing the cost of components. Thickness is conducive to the miniaturization of devices.
[0046] The electromagnetic shielding module packaging structure 100 provided in this embodiment includes a module substrate 110, a chip 130, a partition shielding device 150, a protective plastic package 170, and a metal shielding layer 190. The chip 130 is mounted on the module substrate 110, and the partition shielding The device 150 is mounted on the module substrate 110 and covered outside the chip 130. The protective plastic package 170 is arranged on the module substrate 110 and covered outside the partition shielding devic...
no. 2 example
[0061] See Figure 4 and Figure 5 , this embodiment provides an electromagnetic shielding module packaging structure 100, its basic structure and principle and the technical effects produced are the same as those of the first embodiment, for a brief description, for the part not mentioned in this embodiment, please refer to the first Corresponding content in an embodiment.
[0062] The electromagnetic shielding module packaging structure 100 provided in this embodiment includes a module substrate 110, a chip 130, a partition shielding device 150, a protective plastic package 170, and a metal shielding layer 190. The chip 130 is mounted on the module substrate 110, and the partition shielding The device 150 is mounted on the module substrate 110 and covered outside the chip 130. The protective plastic package 170 is arranged on the module substrate 110 and covered outside the partition shielding device 150. The metal shielding layer 190 is covered on the protective plastic pa...
no. 3 example
[0068] See Figure 6 to Figure 8 , this embodiment provides an electromagnetic shielding module packaging structure 100, its basic structure and principle and the technical effects produced are the same as those of the first embodiment, for a brief description, for the part not mentioned in this embodiment, please refer to the first Corresponding content in an embodiment.
[0069] In this embodiment, the electromagnetic shielding module packaging structure 100 includes a module substrate 110, a chip 130, a partition shielding device 150, a protective plastic package 170, and a metal shielding layer 190. The chip 130 is mounted on the module substrate 110, and the partition shielding The device 150 is mounted on the module substrate 110 and covered outside the chip 130. The protective plastic package 170 is arranged on the module substrate 110 and covered outside the partition shielding device 150. The metal shielding layer 190 is covered on the protective plastic package. 170...
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