1results about How to "Extend curing time" patented technology

The application provides a semiconductor laser and a packaging method thereof. The packaging method of the semiconductor laser comprises the following steps: forming a solder structure on one side of a heat sink along a first direction, wherein the solder structure comprises a first solder layer, a porous barrier layer and a second solder layer which are sequentially stacked away from the heat sink along the first direction, the melting point of the first solder layer is greater than that of the second solder layer; the eutectic temperature of the material of the second solder layer and the material of the porous barrier layer is greater than the eutectic temperature of the material of the second solder layer and the first solder layer; arranging a substrate-free semiconductor laser chip on the side of the solder structure away from the heat sink, and performing soldering, wherein the soldering temperature is greater than the melting point of the second solder layer and less than the melting point of the first solder layer.