Resin glue adhesive for E0 grade fibre board

A technology for synthetic resins and adhesives, applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., which can solve the problems of water resistance, aging resistance, deterioration of mechanical properties of wood-based panels, and reduction of free formaldehyde Content and other issues, to achieve the effect of fast curing speed, suitable curing time and acid-base buffer volume, and strong process adaptability

Inactive Publication Date: 2008-11-19
DARE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The invention provides a synthetic resin adhesive for high-density fiberboard with low formaldehyde emission, which can overcome the reduction of crosslinking degree, prolongation of curing time, and decline of water resistance and aging resistance of the existing synthetic resin adhesive for E0 grade fiberboard. Moreover, the storage period is shortened, and the mechanical properties of wood-based panels are deteriorated. On the premise of effectively reducing the content of free formaldehyde, the adhesive of the present invention has good bonding strength, suitable curing time and acid-base buffering capacity, and good storage stability. , can be used to produce E0 / E1 grade fiberboard, to meet the market demand for high environmental performance fiberboard products

Method used

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  • Resin glue adhesive for E0 grade fibre board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1 is a synthetic resin adhesive for grade E0 fiberboard according to the present invention, which consists of 98.5% melamine-modified urea-formaldehyde resin and 1.5% ammonium sulfate by weight percentage.

[0029] The mass proportioning of melamine modified urea-formaldehyde resin reaction material is, 99.8% melamine 5.3%, 98.0% urea 40.6%, 37.0% formaldehyde 53.6%, accelerator 0.5%, and total molar ratio is 0.925; Accelerator is can buy from the market The mf-01 accelerator produced by Zhenyang Printing and Dyeing Auxiliary Factory, Qiting Town, Yixing City, Jiangsu Province. The above materials are reacted to prepare a synthetic resin adhesive.

[0030] The method of preparation is as follows:

[0031] Feed amount of reaction materials

[0032] 1. Formaldehyde: 11800KG;

[0033] 2. Urea: U11=200KG, U12=3700KG, U2=2150KG, U3=3000KG

[0034] 3. Melamine: M1=850KG, M2=200KG

[0035] 4. High-efficiency accelerator: the first time: 25KG, the second time: 25KG...

Embodiment 2～4

[0047] The preparation method of the synthetic resin adhesive for E0 grade fiberboard is the same as in Example 1, except that the mass ratio of the melamine-modified urea-formaldehyde resin reaction material is adjusted, and the mass ratio and the free formaldehyde content (%) in the adhesive are as follows 2 shows:

[0048] Free formaldehyde content (%) in the synthetic resin adhesive of table 2

[0049]

Example

Melamine

Amine content

(%)

urea

content

(%)

formaldehyde

content

(%)

total moles

Compare

Accelerator

content

(%)

Free formazan

Aldehyde content

(%)

2

5.5

40.4

52.9

0.90

0.5

0.060

3

5.0

40.8

53.8

0.928

0.5

0.065

4

4.8

40.9

53.9

0.930

0.5

0.072

[0050] The adhesive in the above-mentioned each embodiment is manufactured...

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Abstract

The invention discloses a synthetic resin cementing compound used for an EO-stage fiberboard. The synthetic resin cementing compound consists of melamine modified urea resin and a firming agent and is characterized in that the compositions of reaction material of the urea resin by weight percentage are: 4.0 to 6.0 percent of the melamine, 40.0 to 42.0 percent of urea, 52.0 to 56.0 percent of formaldehyde, and 0.4 to 0.6 percent of an accelerating agent; acid and alkali are appropriate and the total mol ratio is between 0.90 and 0.93; and the cementing compound is obtained by the systemization and reaction of the materials. The cementing compound has good cementation strength, appropriate curing time, and the content of 0.06 to 0.08 percent of free formaldehyde, etc. E1 and the E0-stage fiberboard with good quality can be produced stably and have the advantages of low glue feeding amount, strong adaptability to the hot press molding technology and high curing speed in the hot press molding process, etc., thereby meeting the need of the market on products of high environmental performance fiberboards.

Description

technical field [0001] The invention relates to an adhesive for wood-based panels, in particular to a synthetic resin adhesive for high-density fiberboards meeting environmental protection requirements. Background technique [0002] The conventional dry fiberboard manufacturing process uses air as the slab forming medium, and the moisture content of the formed slab is only 5-10%. Due to the lack of moisture in the slab, the pressure and temperature in the hot pressing process alone cannot form sufficient bonding force between the fibers, so a certain amount of adhesive must be added to improve the strength and water resistance of the finished product. [0003] Due to the excellent bonding performance and low cost of synthetic resin adhesives, synthetic resin adhesives are basically used in the wood industry and fiberboard manufacturing at present. The adhesive used in wood-based panels is mainly urea-formaldehyde resin adhesive, accounting for more than 90% of the total amo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/32B27N3/04B27N1/02
Inventor 史志华
Owner DARE TECH
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