51results about How to "High curing activity" patented technology

The invention discloses an ultraviolet curing coating. The ultraviolet curing coating is characterized by comprising basic resin, a diluting agent and a light initiator, wherein the basic resin comprises urethane acrylate resin and self-initiating polyester acrylate resin; and the light initiator comprises normal light initiator and low-yellowing light initiator. The coating provided by the invention has high curing activity; a paint film has the advantages of high hardness, high wear resistance, superior chemical resistance, low yellowing, high weather resistance and the like; and the coating is suitable for various plastic materials.

The invention discloses a preparation method for an organic silicon resin with high curing activity and high temperature resistance, which comprises the following steps: carrying out hydrolytic polycondensation on two kinds of alkyl alkoxy silane and one kind of metal acid ester to polymerize into a silicone resin polymer with proper molecular weight; and using a low-toxic organic solvent as a diluting agent, and adding a curing agent into the low-toxic organic solvent so as to obtain the organic silicon resin with high curing activity and high temperature resistance which can be used as a coating matrix resin. Compared with the common organic silicon resin, the synthetical organic resin has the advantages of excellent heat resistance, high curing activity, good adhesive force, considerable stability, excellent light stability, and excellent environmental friendliness; the preparation method has simpler synthetic route, easily-obtained raw materials, and low price; and the synthetical silicon resin is a low-cost and high performance resin, and is suitable for large-scale preparation and industrialized production.

The invention provides an active ester curing agent and relates to the field of copper-cladding plates. The active ester curing agent has a dicyclopentadiene-phenyl ester alternate structure. On one hand, a dicyclopentadiene structure of the active ester curing agent is capable of well preserving excellent properties such as low hygroscopicity, dielectric constant and dielectric loss angle tangentcaused after the reaction between the curing agent and epoxy resin. On the other hand, the content of an active ester structure in the structure is relatively high, so that the curing agent has veryhigh reaction activity in the reaction with the epoxy resin. The preparation method of the active ester curing agent is easy in operation, the raw materials are easily available, and the large-scale industrial production can be realized. The invention further provides an epoxy resin composition. By virtue of reasonable matching of the active ester curing agent, the epoxy resin and an imidazole compound in a specific proportion, the epoxy resin composition is high in curing activity and has a good curing effect, and a cured condensate has excellent dielectricity and water absorption property and can be used for preparing prepregs, laminated boards and copper-cladding plates.

The invention relates to low-refractive optical fiber coating resin. The low-refractive optical fiber coating resin is prepared from, by weight, 30-65% of prepolymer A, 0-40% of prepolymer B, 2-8% of a photoinitiator, 20-40% of an active diluent and 0.5-2% of a silane coupling agent, and the sum of the weight percentages of all the components is 100%. The low-refractive optical fiber coating resin is high in adhesive power, optical fiber is not likely to be broken when bent, and the low-refractive optical fiber coating resin is low in refractive rate and can enlarge the digital transmission aperture of the optical fiber.

The invention discloses a high sensitivity mobile phone protection screen full lamination adhesive and a preparation method thereof. The high sensitivity mobile phone protection screen full laminationadhesive comprises, by mass fraction, 10-20% of an oligomer, 70-90% of an acrylate active monomer, 2-6% of a photoinitiator and 1-3% of assistants. The high sensitivity mobile phone protection screenfull lamination adhesive provided by the invention not only has the characteristics of high sensitivity, high transparency, low odor, high lamination degree, environmental protection, etc., also is not added with any solvent, has heavy metal, toluene, formaldehyde, methanol meeting the EU ROSH and REACH standards, and has good peeling performance.

This invention relates to products H made by reaction of a cyclic alkyleneurea U, at least one multifunctional aldehyde A2, and at least one of (a) an aminoplast former M that is not the same as the cyclic alkyleneurea U, and (b) a monofunctional aldehyde A1, which product H is optionally etherified by reaction of at least a part of the hydroxyl groups formed by addition reaction of N—H groups and aldehyde groups, with an alcohol having from one to ten carbon atoms, and wherein glyoxal is present in the at least one multifunctional aldehyde A2, to processes for their preparation, and to a method of use thereof in coating compositions.

The invention discloses an organic silicon resin capable of curing at room temperature and mixed with boron and a preparation method and an application thereof. The structure of the organic silicon resin mixed with boron is shown as the following formula and has excellent high temperature resistance and high curing activity compared with ordinary organic silicon resin. A coated film can be actually dried at the temperature of 100 DEG C after 5-10 min, and can be actually dried at the room temperature after 30-60 min, and the cured coated film can totally overcome the phenomenon of repeated adhesion. The organic silicon resin capable of curing at room temperature and mixed with boron uses diluents and curing agents low in toxicity when used for curing films and is environment-friendly. The synthetizing route is concise and easy to operate, the raw materials are easy to obtain, and the organic silicon resin is suitable for pilot plant test and industrial production.

The invention discloses a vegetable oil-based epoxy prepolymer and a preparation method thereof. The vegetable oil-based epoxy prepolymer has a structure shown by a general formula (I) shown in the specification. The invention further discloses a vegetable oil-based UV curing prepolymer as well as a preparation method and application thereof. According to the method, the vegetable oil-based epoxyprepolymer is firstly prepared by prepolymerizing a vegetable oil D-A reaction product with water and epichlorohydrin, and then the vegetable oil-based epoxy prepolymer reacts with pentaerythritol triacrylate to obtain the vegetable oil-based UV curing prepolymer; vegetable oil is introduced into the UV curing prepolymer, thereby greatly reducing the use amount of conventional petrochemical-derived raw materials. The vegetable oil-based UV curing prepolymer provided by the invention has very high UV curing activity and can be rapidly cured into a film in 10 to 60 s, and the cured film is goodin adhesion and excellent in physical properties, mechanical properties and thermal properties, and can be widely applied to the fields of UV curing coatings, inks, adhesives, 3D printing and other UVcuring materials.

The invention belongs to the technical field of powder coatings, particularly relates to a low-temperature quick-curing polyester resin, and further discloses an extinction type powder coating for coiled materials, which is prepared from the low-temperature quick-curing polyester resin. The low-temperature quick-curing polyester resin is prepared by polymerizing the following raw materials: 3, 3-dimethyl glutaric acid, terephthalic acid, an acrylic polymer, diglycidyl adipate, neopentyl glycol, 1, 4-naphthalene dimethanol, 1, 10-decylenediamine and ethylenediamine-N, N '-diacetic acid. The low-temperature quick-curing polyester resin product contains active amino, amide groups with different structures and a small amount of carboxyl, the final acid value is relatively low (less than 12mgKOH/g), the total amine value is relatively high (35-45mgKOH/g), low-temperature quick curing can be conveniently realized completely, and a self-extinction effect is achieved.

The invention discloses a preparation method of epoxy resin for a high-hardness and low-temperature curing type powder coating. The epoxy resin is prepared from the following raw materials in parts bymole: 3-5 parts of melamine, 30-40 parts of formaldehyde, 3-6 parts of hexafluorobutanol, 15-25 parts of cyclohexane, 2-4 parts of phosphorus pentoxide, 6-11 parts of glutaric anhydride, 2-4 parts ofpyromellitic dianhydride, 5-10 parts of pentaerythritol tetraglycidyl ether, a catalyst and a pH regulator. The obtained epoxy resin does not contain halogen elements, contains nitrogen, phosphine and other environment-friendly flame-retardant elements, has good flame retardancy, has high cross-linking density with a film obtained after low-temperature curing of a dicyandiamide curing agent, haspencil hardness of 3H or above, and has excellent water boiling resistance, neutral salt mist resistance and flame retardancy.

The invention discloses a preparation method of boronized furan resin, belonging to the technical field of furan resin production. The preparation method comprises the following steps that: furan resin is used as a carbon source, and boronic acid is added for boronation so as to obtain boronized furan resin. According to the invention, the doped boric acid can effectively improve the graphitization degree of the furan resin, so the wear resistance, thermal shock resistance and shock absorption of the furan resin are improved, the fatigue resistance, creep resistance, corrosion resistance and wear resistance of the furan resin are better, a thermal expansion coefficient of the furan resin is smaller, and the furan resin has more excellent high-temperature resistance and very high curing activity; and by improving raw materials and the preparation method, the process of production is mild and easy to control, gel curing is not easily to occur, a synthesis route is simple, operation is easy, dehydration is not required, and wastewater is not generated.

The invention relates to the technical field of curing agents, particularly provides a curing agent and a urea-formaldehyde resin composition containing the same. The curing agent is prepared from atleast a nitrogen-containing compound and a solvent, wherein the mass ratio of the nitrogen-containing compound to the solvent is (1.5-2.5):3.

The invention relates to the field of high polymer materials and preparation, and particularly discloses a high-temperature-resistant and high-strength epoxy adhesive capable of being cured at medium and low temperatures and a preparation method of the high-temperature-resistant and high-strength epoxy adhesive capable of being cured at medium and low temperatures. The curing temperature of the adhesive is effectively reduced, and meanwhile, the high-temperature adhesive property of the adhesive is remarkably improved. And the viscosity of the adhesive is adjusted through the filler. The epoxy adhesive can be cured at medium and low temperature (not more than 110 DEG C), and the tensile-shear strength at 250 DEG C is not less than 6.5 MPa. The epoxy adhesive provided by the invention is simple in preparation method, mild in curing condition and suitable for construction operation in various occasions.