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Chitosan-modified low-temperature epoxy resin curing agent and preparation method thereof

A technology of epoxy resin curing and chitosan modification, which is applied in the preparation of sugar derivatives, chemical instruments and methods, esterified saccharides, etc., can solve the problems of strong irritation, strong odor, and high toxicity of curing agents. Achieve obvious effect and simple process

Inactive Publication Date: 2017-03-15
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the field of epoxy resin curing agent, room temperature and heating curing agent can meet the requirements of most occasions, but in the field of low temperature fast curing, especially in low temperature environment (such as -5 ℃), the curing of aliphatic polyamine system is extremely slow, Even without curing, the cured product has low strength, poor toughness, poor chemical resistance and loss of use value
Moreover, the curing agent itself is highly toxic and irritating, which has a great impact on the human body and the environment.
[0004] Most of the low-temperature curing agents on the market are directly synthesized products of fatty amines and thioureas or low-molecular thiol compounds, which have obvious disadvantages: the products synthesized by the former contain a large amount of free amines, which have a strong smell and strong irritation. Extremely inconvenient; the latter low-molecular-weight thiol compound not only has a strong odor and poor temperature resistance, but also has a greater impact on the mechanical properties of the cured product
None of them are antimicrobial, which limits their range of applications

Method used

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  • Chitosan-modified low-temperature epoxy resin curing agent and preparation method thereof
  • Chitosan-modified low-temperature epoxy resin curing agent and preparation method thereof

Examples

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Embodiment 1

[0018] (1) Preparation of low-molecular-weight chitosan: weigh 5g of chitosan in a 500ml beaker, then add 200ml of 10% acetic acid solution, heat the resulting mixed solution to 60°C, and use a power of 100w, ultrasonic frequency Place the probe of a 30Hz ultrasonic cell pulverizer in a beaker and degrade it for 30 hours. After the solution is cooled to room temperature, add 10% sodium solution dropwise to adjust the pH value to 7. Filter to remove the precipitate, and put the clear solution into a dialysis bag in distilled water. Dialyzed in medium for 24 hours, the solution was concentrated, ethanol was added to precipitate the precipitate, separated and dried in a vacuum oven at 50°C at low temperature to obtain low molecular weight chitosan, the reaction yield was 85%;

[0019] (2) Preparation of thiourea-modified amine: In a 250mL clean four-neck flask equipped with a stirring device, a condensing device, a tail gas absorption device for NaOH solution and a thermometer, ad...

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Abstract

The invention discloses a chitosan-modified low-temperature epoxy resin curing agent. The curing agent is of a structural formula as following, wherein R is long-chain alkyl, m is an integer between 1 and 2, and n is any integer between 1 and 3. The invention further discloses a preparation method of the chitosan-modified low-temperature epoxy resin curing agent. The solid molecular structure of chitosan-modified low-temperature epoxy resin contains low-temperature active groups such as phenolic hydroxyl groups, thiocarbonyl groups and secondary amino groups, the chitosan-modified low-temperature epoxy resin can be cured normally even at low temperature of minus 5 DEG C as compared with E-44 epoxy resin, E-51 epoxy resin and E-20 epoxy resin with high curing activity, and the curing agent applied to epoxy resin paint is good in adhesion with base materials and resistant to impact. The curing agent is long lasting in sterilization, safe, environment friendly, simple in process and obvious in effect.

Description

technical field [0001] The invention relates to the field of preparation of an epoxy resin curing agent, in particular to a chitosan-modified low-temperature epoxy resin curing agent and a preparation method thereof. Background technique [0002] With the development of society, people pay more and more attention to the antibacterial properties of materials. Commonly used antibacterial materials mainly include inorganic metal mineral materials, organic heterocyclic antibacterial materials and natural antibacterial materials. Because natural antibacterial materials come from nature, are highly safe to the human body, and meet the requirements of green environmental protection, they have been welcomed by people in recent years. Chitosan is widely found in the shells of shrimps, crabs and insects, as well as in the cell walls of algae and fungi in nature. It is a natural polymer with rich sources and various biological activities. By introducing groups such as acyl groups, al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08B37/08C07H13/12C07H1/00
CPCC07H1/00C07H13/12C08B37/003C08G59/62
Inventor 俞成丙石小龙伍芳芳朱文婷董海涛
Owner SHANGHAI UNIV
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