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Semiconductor package structure and its heat sink

A technology of packaging structure and heat sink, which is applied to semiconductor devices, semiconductor/solid-state device components, and electric solid-state devices, etc., can solve the problem of glue overflow from the central tip hole 421, uneven pressure in the mold, poor glue filling efficiency, etc. problem, to avoid the problem of glue overflow and inhibit the effect of glue overflow

Active Publication Date: 2016-08-10
SILICONWARE PRECISION IND CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0015] However, in the existing manufacturing method of the semiconductor package structure 4, the glue filling efficiency is not good by means of side glue filling, and because of the design of the center upper sharp hole 421, the pressure in the mold is not uniform, and it is easy to be in the center. The problem of glue overflow at the upper tip hole 421

Method used

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  • Semiconductor package structure and its heat sink
  • Semiconductor package structure and its heat sink
  • Semiconductor package structure and its heat sink

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Embodiment Construction

[0080] Hereinafter, specific specific examples are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0081] It should be noted that the structure, ratio, size, etc. shown in the accompanying drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limited conditions, so it does not have technical significance. Any structural modification, proportional relationship change, or size adjustment should still fall under the present invention without affecting the effects and objectives that can be achieved by the present invention. The disclosed technical content must be within the scope of coverage. At the same time, the terms such as "upper"...

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Abstract

Provided are a semiconductor packaging structure and a heat dissipation member thereof. The semiconductor packaging structure comprises a bearing member having a semiconductor assembly and a heat dissipation member so that an accommodation space is formed between the heat dissipation member and the bearing member to make the semiconductor assembly positioned in the accommodation space. The heat dissipation member has a guide channel which is provided with a through hole and a recessed structure. The though hole is communicated with the accommodation space. The recesses structure is connected with a hole wall of the through hole, such that if a packaging rubber body is formed in the accommodation space and the recessed structure to wrap the semiconductor assembly, excessive glue is prevented from flowing around the through hole, and the heat dissipation efficiency can be improved.

Description

Technical field [0001] The invention relates to a semiconductor packaging structure, in particular to a semiconductor packaging structure with a heat sink and its heat sink. Background technique [0002] In the current heat dissipation technology of semiconductor packaging structures, heat dissipation elements are often arranged on the outside of the structure so that the heat dissipation elements are in contact with the air as a heat dissipation method, such as figure 1 The semiconductor packaging structure 1 shown has a packaging substrate 10, a semiconductor component 11 provided on the packaging substrate 10, a heat sink 12 provided on the packaging substrate 10 to cover the semiconductor component 11, and covering the The packaging glue 13 on the side of the semiconductor component 11 and the heat sink 12. The heat dissipating element 12 has a central through hole 120, so that the packaging compound 13 is filled into the inner side of the heat dissipating element 12 through ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367
CPCH01L2224/48091H01L2224/48227H01L2224/73265H01L2924/15311H01L2924/00014
Inventor 赖清文陈建志赖裕庭黄承文
Owner SILICONWARE PRECISION IND CO LTD
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