Double sided adhesive tape processing method without adhesive overflow

Abstract

The invention relates to a double sided adhesive tape processing method without adhesive overflow. The process method comprises the following steps: (1) processing a double sided adhesive tape, namely refrigerating for more than 2 hours at a temperature of 0-5 C degree; (2) designing a mold, namely compensating the product dimension and preserving adhesive overflow space; (3) selecting materials; and (4) selecting a device, wherein the sleeve cutting of a circular cutter needs to be controlled within being - / +0.10mm, the circular cutter is high in sleeve cutting precision and stable in performance; the sleeve cutting state during processing needs relatively greatly attention, so that the offsetting of the sleeve cutting can be spotted and the mold can be adjusted in time. According to the double sided adhesive tape processing method, no adhesive overflow occurs during the mold cutting of the double sided adhesive tape; after being delivered, the double sided adhesive tape can be stored at the room temperature at a client; the occurrence that normal surface mounting cannot be carried out due to adhesive overflow during automatic surface mounting in a production line is avoided; the problem of the adhesive overflow of the double sided adhesive tape is ingeniously solved; when the client carries out automatic surface mounting, the problem that a production is boned on a suction nozzle and the surface mounting cannot be carried out due to adhesive overflow never come up again.

Description

technical field [0001] The invention relates to a zero-spill glue processing method for double-sided adhesive, which is mainly used for processing double-sided glue that is prone to overflow, such as water glue, conductive glue with a thickness of more than 0.1mm, or foam glue, etc., which belongs to double-sided adhesive The technical field of glue processing. Background technique [0002] The traditional double-sided adhesive processing technology is the reverse cutting process. The double-sided adhesive is frozen before die-cutting, and then the waste rubber of the handle is cut out first. The knife die is punched from the face paper, half-cut to the cover, and then the outer frame of the product is punched. , discharge the relevant waste, and then transfer the product to the material tape, and finally cut the material tape, and the product is rolled. This processing method cannot avoid the problem of glue overflow, and it can be controlled according to 0.1mm of glue ove...

AI Technical Summary

Problems solved by technology

This processing method cannot avoid the problem of glue overflow, and it can be controlled according to 0.1mm of glue overflow, and some can be achieved, but it cannot be controlled according to "zero" glue overflow

In addition, more and more customers require double-sided adhesive manufacturers to ship products in rolls. Since the double-sided adhesive products in rolls are stored at room temperature and are not stored in the freezer, it is easy to cause glue overflow.

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