Optical cement bonding method and device

A technology of laminating device and optical glue, applied in chemical instruments and methods, lamination devices, layered products, etc., can solve the problems of optical glue overflowing and bubble rebound, and reduce glue overflow, reduce continuous extrusion, The effect of improving product yield and efficiency
CN109094172AInactive Publication Date: 2018-12-28TRULY OPTO ELECTRONICS
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
TRULY OPTO ELECTRONICS
Publication Date
2018-12-28
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention provides an optical cement bonding method and device. The method comprises following steps: a to-be-bonded substrate is provided; optical cement is distributed in the position below theto-be-bonded substrate correspondingly; a roller located below the optical cement is provided, and the roller applies pressure upward to the optical cement and rolls along the optical cement, so thatthe optical cement is enabled to be attached to the to-be-bonded substrate. The device comprises a to-be-bonded substrate fixing part, a machine table arranged below the to-be-bonded substrate fixingpart, a mesh plate arranged on the machine table and corresponding to the to-be-bonded substrate fixing part and the roller, wherein the to-be-bonded substrate fixing part is used for fixing the to-be-bonded substrate by vacuum absorption, the optical cement is fixed on one side, facing the to-be-bonded substrate fixing part, of the mesh plate, and the roller is arranged on one side, opposite to the to-be-bonded substrate fixing part, of the mesh plate. According to the optical cement bonding method and device, the problem of cement overflow during bonding of the optical cement can be solved effectively.
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Description

technical field

[0001] The invention relates to the field of display technology, in particular to an optical adhesive bonding method and device. Background technique

[0002] Nowadays, as people have higher and higher requirements for the user experience of display products, they also have higher and higher requirements for thinner and lighter products and narrower borders. Products such as mobile phones, tablet computers and monitors are getting thinner and thinner. The optical glue in the product is also required to be thinner and thinner, and in order to fill the surface level difference of various substrates to be bonded, such as the ink level difference on the cover plate caused by ink coating, the optical glue is also getting softer. The current optical adhesive bonding method is generally to place the optical adhesive on the substrate to be bonded, and then use a roller to press down from the edge of one end of the optical adhesive, and then roll it to the other side,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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