Wafer bonding and packaging method of silicon-based OLED
A packaging method and silicon-based technology, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of easy clogging of the glue application needle, unsmooth glue dispensing, and long glue application time, so as to avoid defects. Side effects, improving production efficiency, and speeding up the effect of gluing time
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[0024] The technical solution of the present invention will be explained more clearly and completely through the description of preferred embodiments of the present invention in conjunction with the accompanying drawings.
[0025] like Figure 2 to Figure 4 As shown, the silicon-based OLED wafer bonding and packaging method of the preferred embodiment of the present invention includes the following steps:
[0026] Step 1: Apply the structural adhesive to the silicon-based substrate by screen printing technology.
[0027] Specifically, the first step is: place the screen 2 on the silicon substrate 1, place the structural glue 3 on one side of the screen 2, and apply the structural glue 3 on the outside of the structural glue 3 along one direction with the scraper 4. On the mesh plate 2 and the silicon base substrate 1. Preferably, the porosity of the mesh plate is 2%-59%.
[0028] Preferably, after the structural adhesive is coated, UV curing structural adhesive is used.
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