Cofferdam type glue sticking process
A water-glue and cofferdam technology, applied in the field of cofferdam-type water-glue lamination technology, can solve problems affecting lamination efficiency and lamination machine pollution, so as to improve lamination yield, solve the problem of glue overflow, and prevent overflow effect
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[0014] The present invention will be further described below with reference to the drawings and embodiments. It can be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for ease of description, the drawings only show a part but not all of the content related to the present invention.
[0015] Please refer to figure 1 As shown, in this embodiment, the glue with automatic initial curing function is named glue a, the glue for laminating is named glue b, 101 is glue a dispensing area, 102 is glue b dispensing area, 103 is functional glass Sheet, 104 is a flexible circuit board.
[0016] Such as figure 2 As shown, the cofferdam type water glue bonding process in this embodiment specifically includes the following steps:
[0017] Step S201: Place the bound functional glass sheet 103 on the laminating platform, set the dispensing amount, and evenly dot the ...
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