Substrate temperature measuring device and substrate temperature measuring method

Abstract

The present invention relates to a substrate temperature measuring device and a substrate temperature measuring method. More specifically, it aims to provide a substrate temperature measuring device and a substrate temperature measuring method capable of measuring the temperature of a substrate in a substrate processing process in real time. The substrate temperature measuring device of the present invention for achieving the above object includes a probe provided so that a substrate support portion for supporting a substrate to perform a substrate processing step penetrates up and down, and an upper end of the probe protrudes from an upper surface of the substrate support portion, wherein , the upper end of the probe is configured to contact the lower side of the substrate, so as to measure the temperature of the substrate.

Description

technical field [0001] The invention relates to a substrate temperature measuring device and a substrate temperature measuring method, in particular to a substrate temperature measuring device and a substrate temperature measuring method which can measure the temperature of a substrate in a substrate processing process in real time. Background technique [0002] Today, semiconductor packaging technology is being applied as a method for realizing larger capacity and higher performance of semiconductor products. [0003] In such a semiconductor packaging process, a process of forming bumping balls that electrically connect a semiconductor-mounted substrate or different semiconductors is called a reflow process. [0004] Generally, the substrate used in the reflow process is made of silica gel (Si). [0005] The reflow process is configured to heat the substrate to temporarily satisfy the high temperature state of the substrate, and the reflow process is performed in the high ...

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Problems solved by technology

[0009] Therefore, it is difficult to accurately obtain the temperature of the target substrate in real time in the reflow process, thereby adjusting the process environment and ensuring the yield.

[0010] In addition, it is necessary to periodically prepare the substrate for temperature measurement and measure the temperature, which may lead to unnecessary waste of time and decrease in process yield.

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