The invention relates to a high-temperature-resistant
adhesive tape as well as a high-temperature-resistant release film and a high-temperature-resistant
adhesive used by the high-temperature-resistant
adhesive tape. A
raw material formula of the high-temperature-resistant adhesive comprises the following components: 40-80 parts of
ethylene glycol dimethacrylate, 20-30 parts of octadecyl
acrylate, 5-10 parts of phenyltrimethoxysilane, 5-10 parts of vinyltriisopropenyloxysilane, 2-10 parts of nano-silica, 1-5 parts of
aluminium hexafluoroacetylacetonate, 2-6 parts of
polyvinyl alcohol, 2-5 parts of an emulsifier, 1-3 parts of an initiator and 200-350 parts of deionized water. A
raw material formula of a film spraying material of the high-temperature-resistant release film comprises the following components: 60-80 parts of
polyimide, 10-30 parts of 1,3,5-
tris(3,3,3-trifluoropropyl)methylcyclotrisiloxane, 5-25 parts of
polybutylene terephthalate, 2-10 parts of an
ethylene vinyl acetate copolymer, 2-8 parts of vinyl phenyl
silicon oil, 1-3 parts of
dioctyl sebacate and 1-4 parts of
dibutyltin dilaurate. The heat-resistant
pressure sensitive adhesive tape prepared by the invention can work at 70-160 DEG C and can
resist the high temperature of 600 DEG C or above in a short time.