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High-temperature-resistant adhesive tape as well as high-temperature-resistant release film and high-temperature-resistant adhesive used by high-temperature-resistant adhesive tape

A high temperature resistant and adhesive technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., can solve the problems of film deformation, high temperature difference, low melting point, etc.

Active Publication Date: 2015-07-22
苏州市伽俐电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The release film used in traditional tapes can be divided into three categories according to raw materials: glassine release film, polyethylene coated release film (PEK) and kaolin coated release film. Among them, polyethylene coated release film is because of its Dimensional stability and other advantages, mass-produced in China, and widely used in tapes, advertising and other industries, but the melting point of polyethylene is low, it will soften at about 80 ° C, thereby degrading, and such as polyvinyl chloride, polycarbonate Although , polyurethane and nylon can also be used in different fields, their common disadvantage is that they are poor in high temperature resistance. Industry is not allowed
[0004] Traditional adhesives include acrylic adhesives, natural rubber adhesives and synthetic rubber adhesives. Among the three adhesives, synthetic rubber adhesives have the worst high temperature resistance, while acrylic adhesives have better high temperature resistance, but at higher temperatures, acrylic adhesives The heat resistance becomes worse and worse. As the temperature rises to 100°C, the peel strength of the tape will gradually decrease and the holding force will also decrease significantly.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0075] Embodiment 1: high temperature resistant release film;

[0076] The raw material formulation of the coating material of the high temperature resistant release film includes the following materials by weight:

[0077] 65 parts of polyimide;

[0078] 15 parts of trifluoropropylmethylcyclotrisiloxane;

[0079] 10 parts of polybutylene terephthalate;

[0080] 4 parts of ethylene-vinyl acetate copolymer;

[0081] 4 parts of vinyl phenyl silicone oil;

[0082] Dioctyl sebacate 1 part;

[0083] 1 part of dibutyltin dilaurate.

[0084] The preparation process of high temperature resistant release film comprises the following steps:

[0085] (1) Mix corresponding weight parts of polyimide, trifluoropropylmethylcyclotrisiloxane, polybutylene terephthalate, and ethylene-vinyl acetate copolymer according to the raw material formula of the coating material , stir well with a mixer;

[0086] (2) Add vinylphenyl silicone oil, dibutyltin dilaurate, and dioctyl sebacate to the m...

Embodiment 2

[0088] Embodiment 2: high temperature resistant release film;

[0089] The raw material formulation of the coating material of the high temperature resistant release film includes the following materials by weight:

[0090] 70 parts of polyimide;

[0091] 10 parts of trifluoropropylmethylcyclotrisiloxane;

[0092] 8 parts of polybutylene terephthalate;

[0093] 5 parts of ethylene-vinyl acetate copolymer;

[0094] 3 parts of vinyl phenyl silicone oil;

[0095] Dioctyl sebacate 2 parts;

[0096] 2 parts of dibutyltin dilaurate.

[0097] The preparation process of high temperature resistant release film comprises the following steps:

[0098] (1) Mix corresponding parts by weight of polyimide, trifluoropropylmethylcyclotrisiloxane, polybutylene terephthalate, and ethylene-vinyl acetate copolymer according to the raw material formula of the coating material, Stir thoroughly with a mixer;

[0099] (2) Add vinylphenyl silicone oil, dibutyltin dilaurate, and dioctyl sebacate t...

Embodiment 3

[0101] Embodiment three: high temperature resistant release film;

[0102] The raw material formulation of the coating material of the high temperature resistant release film includes the following materials by weight:

[0103] 60 parts of polyimide;

[0104] 22 parts of trifluoropropylmethylcyclotrisiloxane;

[0105] 6 parts of polybutylene terephthalate;

[0106] 5 parts of ethylene-vinyl acetate copolymer;

[0107] 4 parts of vinyl phenyl silicone oil;

[0108] Dioctyl sebacate 1 part;

[0109] 2 parts of dibutyltin dilaurate.

[0110] The preparation process of high temperature resistant release film comprises the following steps:

[0111] (1) Mix corresponding parts by weight of polyimide, trifluoropropylmethylcyclotrisiloxane, polybutylene terephthalate, and ethylene-vinyl acetate copolymer according to the raw material formula of the coating material, Stir thoroughly with a mixer;

[0112] (2) Add vinylphenyl silicone oil, dibutyltin dilaurate, and dioctyl sebac...

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PUM

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Abstract

The invention relates to a high-temperature-resistant adhesive tape as well as a high-temperature-resistant release film and a high-temperature-resistant adhesive used by the high-temperature-resistant adhesive tape. A raw material formula of the high-temperature-resistant adhesive comprises the following components: 40-80 parts of ethylene glycol dimethacrylate, 20-30 parts of octadecyl acrylate, 5-10 parts of phenyltrimethoxysilane, 5-10 parts of vinyltriisopropenyloxysilane, 2-10 parts of nano-silica, 1-5 parts of aluminium hexafluoroacetylacetonate, 2-6 parts of polyvinyl alcohol, 2-5 parts of an emulsifier, 1-3 parts of an initiator and 200-350 parts of deionized water. A raw material formula of a film spraying material of the high-temperature-resistant release film comprises the following components: 60-80 parts of polyimide, 10-30 parts of 1,3,5-tris(3,3,3-trifluoropropyl)methylcyclotrisiloxane, 5-25 parts of polybutylene terephthalate, 2-10 parts of an ethylene vinyl acetate copolymer, 2-8 parts of vinyl phenyl silicon oil, 1-3 parts of dioctyl sebacate and 1-4 parts of dibutyltin dilaurate. The heat-resistant pressure sensitive adhesive tape prepared by the invention can work at 70-160 DEG C and can resist the high temperature of 600 DEG C or above in a short time.

Description

technical field [0001] The invention relates to a high-temperature-resistant adhesive tape, a high-temperature-resistant release film and a high-temperature-resistant adhesive used therein, and belongs to the technical field of adhesive materials. Background technique [0002] With the rapid development of the economy, heat-resistant tapes have been used as heat preservation and high-temperature paint products resistant to 100°C-200°C, protective tapes for engine or engine room mechanical components, and metal welding fields. Adhesive tape generally consists of base material, release film and adhesive. There is a strong demand for adhesive tapes with excellent heat resistance in the market. [0003] The release film used in traditional tapes can be divided into three categories according to raw materials: glassine release film, polyethylene coated release film (PEK) and kaolin coated release film. Among them, polyethylene coated release film is because of its Dimensional s...

Claims

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Application Information

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IPC IPC(8): C09J135/02C09J11/04C09J7/02C08L79/08C08L67/02C08L23/08C08K5/549C08K5/11C08K5/57
Inventor 夏超华
Owner 苏州市伽俐电子有限公司
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