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Display module, manufacturing method thereof and LED display screen

A technology of display module and manufacturing method, applied in electrical components, electric solid-state devices, circuits, etc., can solve problems such as failure, LED display is susceptible to moisture, etc.

Pending Publication Date: 2020-10-23
LEYARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a display module, its manufacturing method and LED display screen, so as to solve the problem that the LED display screen in the prior art is easily affected by moisture and becomes invalid.

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  • Display module, manufacturing method thereof and LED display screen
  • Display module, manufacturing method thereof and LED display screen

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Embodiment Construction

[0024] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0025] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0026] It should be noted that the terms "first" an...

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Abstract

The invention provides a display module, a manufacturing method thereof and an LED display screen. The display module comprises a driving substrate, carrier plates, a plurality of LED chips and a hydrophobic film, wherein the carrier plates are arranged on the driving substrate at intervals, each carrier plate is provided with a first surface far away from one side of the driving substrate, a plurality of LED chips are arranged on a first surface of the carrier plate, each LED chip is electrically connected with the driving substrate, each LED chip is provided with a first connecting point electrically connected with the carrier plate, a first surface is provided with a second connecting point electrically connected with the LED chips, at least part of the hydrophobic film covers the area,except the first connecting point, in the surface of the LED chip and covers the area, except the second connecting point, in the first surface. The display module is advantaged in that the hydrophobic film is tightly attached to the LED chip and the carrier plate, so water vapor does not make direct contact with an LED, and migration and electrolysis of chip electrode metal caused by the water vapor are avoided, in addition, the display module does not cause visual influence, and the display effect of the LED display screen is greatly improved.

Description

technical field [0001] The invention relates to the field of LED display, in particular to a display module, its manufacturing method and an LED display. Background technique [0002] In order to cope with the outdoor environment, outdoor LED displays generally protect them, such as filling the gaps between the lamps with waterproof glue to protect the solder joints and avoid failure caused by moisture; for small-pitch LED displays, the use environment is mostly indoor or outdoor. Semi-indoor, there is no special protection for it at first. With the application of indoor LED display screens (referred to as indoor screens) more and more widely, short circuits and lack of color will also occur when LED displays are used in humid and hot environments such as coastal areas and southern areas. The main reason for failure is that in a humid environment, water vapor enters the LED lamp, and the LED chip in the lamp is damp, which leads to electrolysis of the chip electrode metal af...

Claims

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Application Information

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IPC IPC(8): H01L33/44H01L23/00H01L33/00
CPCH01L23/564H01L33/005H01L33/44H01L2933/0025
Inventor 卢长军马莉
Owner LEYARD
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