Electronic chip and electronic device

An electronic chip and chip body technology, which is applied in the fields of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of complex structure and large volume of adaptive cooling solutions.

Active Publication Date: 2020-11-17
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to provide an electronic chip and electronic device to solve the technical problem of complex structure and large volume of adaptive heat dissipation scheme in the prior art

Method used

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  • Electronic chip and electronic device
  • Electronic chip and electronic device
  • Electronic chip and electronic device

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Embodiment Construction

[0033] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention provides an electronic chip and an electronic device, and relates to the technical field of microelectronic chips. The electronic chip comprises a chip body which is provided with at least one heating junction region, wherein the interior of the chip body is provided with at least one microfluidic channel, the microfluidic channel is provided with an inlet and an outlet, and the microfluidic channel and the heating junction region correspond to each other in position; and at least one thermosensitive stop piece of which one end is connected with the inner wall of the microfluidicchannel and the other end is freely arranged, and which can be heated to deform so as to change an inclination angle. According to the technical scheme, the electronic chip can convert the power density of the heating junction area of the electronic chip into the deformation quantity of the thermosensitive stop piece through the thermosensitive stop piece with the thermal strain characteristic, the local flow resistance in the microfluidic channel is indirectly changed, and then the heat exchange capacity of a heat dissipation working medium in the microfluidic channel is changed; and on thepremise of not increasing the pumping power of a heat dissipation system, the self-adaptive heat dissipation function of the heat dissipation efficiency is effectively improved.

Description

technical field [0001] The invention relates to the technical field of microelectronic chips, in particular to an electronic chip and an electronic device. Background technique [0002] As the system integration of electronic chips develops in the direction of higher density, more functions, greater power and intelligence, the heat generation per unit area of ​​some high-power density electronic chips continues to increase, and the heating junction area is the main heat source in the electronic chip , if the temperature cannot be controlled within the design value, it will have an adverse effect on the performance and reliability of the electronic chip. According to statistics, 55% of electronic equipment failures are caused by excessive junction temperature, and studies have shown that the reliability of electronic equipment will decrease by 50% for every 10°C increase in the temperature of the heat-generating junction of a single electronic chip. Therefore, it is particul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/427H01L23/473
CPCH01L23/367H01L23/427H01L23/473
Inventor 焦斌斌叶雨欣孔延梅刘瑞文陈大鹏
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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