Circuit board assembly and electronic equipment

A circuit board and sub-circuit board technology, applied in circuit thermal devices, printed circuits, printed circuits, etc., can solve problems such as poor heat dissipation performance of circuit boards, and achieve the effects of improving user experience, improving reliability, and preventing discomfort

Active Publication Date: 2022-03-01
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The application discloses a circuit board device and electronic equipment, which can solve the problem of poor heat dissipation performance of the circuit board in the electronic equipment

Method used

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  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment
  • Circuit board assembly and electronic equipment

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Embodiment Construction

[0023] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0024] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application can be practiced in sequ...

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Abstract

The application discloses a circuit board device and electronic equipment. The disclosed circuit board device includes a circuit board, a liquid driving part and a phase change medium, wherein: the circuit board is provided with a sealed cavity, and the liquid driving part and the phase change medium The variable media are all arranged in the sealed cavity, the sealed cavity has an evaporation area and a condensation area, the first end of the liquid driving part is located in the evaporation area, and the second end of the liquid driving part is located in the In a condensation area, the liquid drive member can transport the phase change medium condensed into a liquid state to the evaporation area. The above solution can solve the problem of poor heat dissipation performance of the circuit board in the electronic device.

Description

technical field [0001] The present application relates to the technical field of circuit board heat dissipation, in particular to a circuit board device and electronic equipment. Background technique [0002] With the improvement of user requirements, electronic equipment has more and more functions, which leads to more and more electronic devices integrated in the electronic equipment. More and more electronic devices not only bring new challenges to the stacking design of circuit boards, but also cause more heat to be generated during the operation of electronic devices. [0003] Take the addition of game functions to electronic devices as an example. With the improvement of user requirements for game quality, fluency, 3D image perception and online number, electronic devices need more powerful processors, and the structure of processors is more complex ( Contains more electronic components) and runs faster, which will cause the electronic equipment to generate more heat ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
CPCH05K1/0201H05K1/0203H05K2201/064
Inventor 郭阳
Owner VIVO MOBILE COMM CO LTD
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