Method for evaluating welding heat resistance of plastic package component

Abstract

The embodiment of the invention discloses a method for evaluating welding heat resistance of a plastic package component. The method comprises the steps of: S10, sampling N to-be-tested components, and obtaining M sampled components; S20, checking a first performance state, judging whether unqualified components exist or not, and if so, executing S30, otherwise, executing S40; S30, rejecting the unqualified components, performing re-sampling, performing first performance state inspection on the re-sampled components until the first performance states of all the sampled components are qualified, and executing S40; S40, carrying out a simulation welding test to obtain M simulation welding components; S50, carrying out second performance state inspection, judging whether unqualified components exist or not, if so, judging that a welding heat resistance evaluation test is unqualified, and otherwise, executing S60; and S60, performing welding heat influence evaluation, and if all the components are qualified, judging that the welding heat resistance evaluation test is qualified, otherwise, judging that the welding heat resistance evaluation test is unqualified.

Description

technical field [0001] The invention relates to the technical field of reliability of military components. More specifically, it relates to a method for evaluating the resistance to soldering heat of plastic-encapsulated components. Background technique [0002] Electronic components are the core and foundation of equipment, and their quality directly affects the reliability of the equipment system. Plastic-encapsulated devices are highly reliable and expensive, and are generally used in military high-reliability fields. With the increasing demand for miniaturization and high integration of plastic-encapsulated devices, the size of plastic-encapsulated devices is getting smaller and smaller, and the leads are getting denser. During the assembly process of components, devices with small size and dense leads are more susceptible to the influence of soldering heat, causing air leakage of plastic-encapsulated devices and remelting of internal soldering parts, resulting in redu...

AI Technical Summary

Problems solved by technology

During the assembly process of components, devices with small size and dense leads are more susceptible to the influence of soldering heat, causing air leakage of plastic-encapsulated devices and remelting of internal soldering parts, resulting in reduced reliability or even failure of the device

[0003] In the existing national military standard GJB360B-2009 method 210 article soldering heat resistance performance evaluation test, the test method for components does not consider the packaging form of the device, the presence or absence of lead on the pins, and the remelting of the internal solder, and the test conditions are not enough Refinement, with the technical development of plastic packaging components and the expansion of the localization of military components, the existing standard methods are becoming more and more difficult to comprehensively and accurately evaluate the soldering heat resistance of plastic packaging components at this stage

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