Method for evaluating welding heat resistance of sealing component
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A technology of soldering heat resistance and evaluation method, which is applied in liquid tightness measurement, instruments, and scientific instruments using liquid/vacuum degree, and can solve the problems of insufficient test conditions, soldering heat resistance of difficult-to-seal components, and internal Problems such as remelting of welding parts
Pending Publication Date: 2021-07-02
航天科工空间工程发展有限公司
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During the assembly process of components, devices with small size and dense leads are more susceptible to the influence of soldering heat, causing air leakage of sealed devices and remelting of internal soldering parts, resulting in reduced reliability or even failure of devices
[0003] In the existing national military standard GJB360B-2009 method 210 article soldering heat resistance performance evaluation test, the test method for components does not consider the packaging form of the device, the presence or absence of lead on the pins, and the remelting of the internal solder, and the test conditions are not enough Refinement, with the technical development of sealed components and the expansion of the localization of military components, the existing standard methods are becoming more and more difficult to comprehensively and accurately evaluate the soldering heat resistance of sealed components at this stage
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[0042] In order to illustrate the present application more clearly, the present application will be further described below in conjunction with preferred embodiments and accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present application.
[0043] Electronic components are the core and foundation of equipment, and their quality directly affects the reliability of the equipment system. Sealed devices are highly reliable and expensive, and are generally used in military high-reliability fields. With the increasing demand for miniaturization and high integration of sealing devices, the size of sealing devices is getting smaller and the leads are getting denser. During the assembly process of components, devices with small size and dense leads are more sus...
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Abstract
The embodiment of the invention discloses a method for evaluating the welding heat resistance of a sealing component. The method comprises the steps of: S10, sampling N to-be-tested components, and obtaining M sampled components; S20, checking a first performance state, judging whether unqualified components exist or not, and if so, executing S30; otherwise, executing S40; S30, rejecting the unqualified components, re-sampling, performing first performance state inspection on the re-sampled components until the first performance states of all the sampled components are qualified, and executing S40; S40, carrying out a simulation welding test to obtain M simulation welding components; S50, carrying out second performance state inspection, judging whether unqualified components exist or not, if so, judging that the welding heat resistance evaluation test is unqualified, and otherwise, executing S60; and S60, performing welding heat influence evaluation, and if all the welding components are qualified, judging that the welding heat resistance evaluation test is qualified, otherwise, judging that the welding heat resistance evaluation test is unqualified.
Description
technical field [0001] The invention relates to the technical field of reliability of military components. More specifically, it relates to a method for evaluating the resistance to soldering heat of sealing components. Background technique [0002] Electronic components are the core and foundation of equipment, and their quality directly affects the reliability of the equipment system. Sealed devices are highly reliable and expensive, and are generally used in military high-reliability fields. With the increasing demand for miniaturization and high integration of sealing devices, the size of sealing devices is getting smaller and the leads are getting denser. During the assembly process of components, devices with small size and dense leads are more susceptible to the influence of soldering heat, causing air leakage of sealed devices and remelting of internal soldering parts, resulting in reduced reliability or even failure of devices. [0003] In the existing national m...
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