Electrolytic copper foil forming device

Abstract

The invention discloses an electrolytic copper foil forming device, comprising a forming device, a cleaning device, a drying device and a winding drum arranged in sequence. The forming device comprises a bracket on which a cathode roller is rotatably installed, and the surface of the cathode roller and the anode plate are connected to each other. There is a certain distance between them; the cathode roller is provided with a water removing device and an air drying device; the drying device includes a drying roller and a water removing device and an air drying device installed on the drying roller. The water removal device can reduce the sputtering of the electrolyte during the squeezing process, and improve the safety and cleanliness of the production environment; the air-drying device can avoid the electrolyte droplets on the surface of the copper foil during the subsequent transmission process by setting a relatively sealed environment. Falling or evaporating, polluting the production environment; the sewage generated by the washing device can be collected uniformly, and will not cause pollution to the production environment and the electrolytic copper foil by sputtering, and can ensure the smooth surface of the electrolytic copper foil structure and improve the quality of the formed copper foil.

Description

technical field [0001] The invention belongs to the field of production equipment of electrolytic copper foil, and in particular relates to an electrolytic copper foil forming device. Background technique [0002] Electrolytic copper foil is formed by gradually depositing copper ions in the electrolysis area on the surface of the cathode roller, and the cathode roller is driven by the motor to rotate slowly. When the cathode roller rotates out of the electrolysis area, a layer of copper foil with a certain thickness is deposited on the surface. ; [0003] Since a large amount of electrolyte is adhered to the surface of the formed copper foil, it is necessary to carry out surface treatment on the formed copper foil to remove the electrolyte on the surface of the copper foil and avoid subsequent oxidation of the copper foil. There are mainly two types of electrolyte in the prior art: One problem is that the copper foil cannot be thoroughly treated, resulting in a considerable...

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Problems solved by technology

[0003] Since a large amount of electrolyte is adhered to the surface of the formed copper foil, it is necessary to carry out surface treatment on the formed copper foil to remove the electrolyte on the surface of the copper foil and avoid subsequent oxidation of the copper foil. There are mainly two types of electrolyte in the prior art: One problem is that the copper foil cannot be thoroughly treated, resulting in a considerable amount of electrolyte or moisture remaining on the surface of the copper foil, which causes the copper foil to be prone to corrosion during subsequent storage and use. On the other hand, The cleaning process will cause damage to the copper foil, thereby affecting the forming quality of the copper foil. In order to solve the above problems, the present invention provides the following technical solutions

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