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Packaging structure and electronic equipment

A packaging structure and packaging layer technology, which is applied in the direction of microstructure technology, microstructure devices, circuits, etc., can solve the problems that affect the packaging structure, optimize the miniaturization and integration of electronic products, and occupy a large space, so as to achieve The effect of small space and improved integration

Pending Publication Date: 2021-10-26
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Abstract
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AI Technical Summary

Problems solved by technology

The current packaging structure occupies a large space, which affects the further optimization and improvement of the packaging structure for the miniaturization and integration of electronic products.

Method used

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  • Packaging structure and electronic equipment

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Embodiment Construction

[0024] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0025] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as any limitation of the invention, its application or uses.

[0026] Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques and devices should be considered part of the description.

[0027] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have different va...

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Abstract

The invention relates to a packaging structure and electronic equipment, and the packaging structure comprises a substrate which is provided with a first surface and a second surface which are opposite to each other, and the first surface and the second surface are each provided with at least one functional device; a packaging layer, comprising a first packaging layer arranged on the first surface and a second packaging layer arranged on the second surface, the functional device located on the first surface being packaged in the first packaging layer, and the functional device located on the second surface being packaged in the second packaging layer. One technical effect of the invention is that the functional devices needing to be integrated are arranged on the two opposite surfaces of the substrate and are packaged through the packaging layer, so that the packaging number of the functional devices on the substrate can be increased, more functional devices can be integrated on the limited area of the substrate, and the integration level is improved. Substrates required by the same number of functional devices are smaller, so that the space occupied by the packaging structure is smaller.

Description

technical field [0001] The present invention relates to the technical field of semiconductor packaging, and more specifically, the present invention relates to a packaging structure and electronic equipment. Background technique [0002] With the development and application of semiconductor technology, the impact of semiconductors on the miniaturization and integration of electronic products is getting higher and higher. In the existing semiconductor packaging technology, parts of devices are usually packaged together on one side of a substrate, and the entire packaged structure is arranged in an electronic product. The current packaging structure occupies a large space, which affects the further optimization and improvement of the packaging structure for the miniaturization and integration of electronic products. Contents of the invention [0003] An object of the present invention is to provide a new technical solution for a packaging structure and electronic equipment....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L25/16B81B7/00
CPCH01L23/3135H01L25/16B81B7/0032
Inventor 许婧陶源王德信
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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