Magnet bar with attached sensor

A magnetic bar and attachment technology, applied in the field of sputtering deposition, can solve the problems of vacuum system damage, waste of substrate materials, etc.

Pending Publication Date: 2021-12-03
SOLERAS ADVANCED COATINGS NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the target is damaged, of limited quality or the wrong target is installed and the sputtering process is started, substrate material is wasted
Also, using the wrong target or ignoring damage in the target can cause damage to the vacuum system itself

Method used

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  • Magnet bar with attached sensor
  • Magnet bar with attached sensor
  • Magnet bar with attached sensor

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Embodiment Construction

[0030] The present invention will be described with respect to particular embodiments and with reference to certain drawings but the invention is not limited thereto but only by the claims. The dimensions and relative dimensions do not correspond to actual simplifications for practicing the invention.

[0031] The terms first, second etc. in the description and claims are used to distinguish similar elements and not necessarily to describe an order in time, space, sequence or in any other way. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein.

[0032] Moreover, the terms "top", "below" and the like in the specification and claims are used for descriptive purposes only and not necessarily for describing relative positions. It is to be understood that the terms so used are interchangeable und...

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PUM

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Abstract

A magnet bar structure (101) for a sputter magnetron system comprises a magnet bar (102) having attached to it a sensing device (110) for sensing intrinsic and / or extrinsic properties of a tubular sputtering target (200) when mounted over the magnet bar structure (101).

Description

technical field [0001] The present invention relates to the field of sputter deposition. More specifically, it relates to the bar magnet structure for tubular targets used in such sputter deposition. Background technique [0002] Physical vapor deposition by means of sputtering has become a standard technique for tailoring the properties of eg glass plates or other rigid or flexible materials. "Sputtering" refers to the atomic bombardment of coating material out of a target by means of positively charged ions, usually argon, which are accelerated by an electric field towards the negatively charged target. Positive ions are formed by impact ionization in the low pressure gas phase. The ejected atoms strike the substrate to be coated, where they form a dense, well-adhering coating. [0003] The ionization of the ion-forming gas is confined near the target surface by means of a magnetic field generated from behind the target surface and exhibits an arcuate closed-loop tunnel...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H01J37/32H01J37/34
CPCH01J37/32935H01J37/342H01J37/3464H01J37/3476H01J37/345H01J37/3405
InventorF·T·汉布尔W·德博斯谢尔I·范德普特
OwnerSOLERAS ADVANCED COATINGS NV