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Biaxial loading in-situ mechanical test microsystem and manufacturing method thereof

A manufacturing method and micro-system technology, applied in the fields of informatics, computer materials science, special data processing applications, etc., can solve the problems of broken joints, inability to decompose complex stress states, and inability to meet quantitative controllability, and achieve accurate load control. , the quantitative and controllable effect of biaxial stress state

Pending Publication Date: 2022-03-15
ZHEJIANG UNIV HANGZHOU GLOBAL SCI & TECH INNOVATION CENT
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, the complex stress state achieved by the former cannot be decomposed and cannot meet the requirements of quantitative control; the latter can only be tested for samples with low strength, otherwise the connection between the substrate and the sample will break before the sample

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  • Biaxial loading in-situ mechanical test microsystem and manufacturing method thereof
  • Biaxial loading in-situ mechanical test microsystem and manufacturing method thereof
  • Biaxial loading in-situ mechanical test microsystem and manufacturing method thereof

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Embodiment Construction

[0045] Combine below Figure 1-5 The present invention will be described in detail.

[0046] A kind of in-situ mechanical testing microsystem design method of biaxial loading of the present invention, comprises the following steps:

[0047] (1) design is used for the superhard material sample size of in-situ mechanical loading, and the top view of superhard material sample is as the present invention figure 1As shown, the sample includes the clamping area corresponding to area 1, the transition area corresponding to area 2, and the gauge length area corresponding to area 3. The length, width, and height of the clamping area are 2 μm, 0.5 μm, and 0.2 μm, respectively. The length, width and height of the transition zone are 0.1 μm, 1.9 μm, and 0.2 μm respectively, and the gauge length zone is approximately a circular area with a diameter of 0.1 μm and a height of 0.2 μm.

[0048] (2) design a kind of geometric structure of the in-situ mechanical test microsystem of biaxial loa...

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Abstract

The invention relates to the technical field of nano material mechanical property testing, and discloses a biaxial loading in-situ mechanical testing microsystem design method which comprises the following steps: S1, setting the size of a superhard material sample for in-situ mechanical loading; s2, setting a geometric structure of the in-situ mechanical test microsystem; s3, setting a geometric structure of a loading area of the in-situ mechanical test microsystem; s4, respectively establishing a mesh model of the superhard material sample and a mesh model of a loading area of the in-situ mechanical test microsystem; s5, simulating and calculating an in-situ mechanical loading process through a finite element method; s6, verifying the reliability of the in-situ mechanical test microsystem in combination with the strain cloud picture obtained through simulation calculation; and S7, based on an SOI technology, carrying out tape-out production according to the verified microsystem structure. Through optimization design and simulation verification methods, the designed in-situ mechanical test microsystem can provide a uniaxial / biaxial stress state, and can regulate and control a material in a larger strain range.

Description

technical field [0001] The invention relates to the technical field of testing the mechanical properties of nanomaterials, in particular to a biaxially loaded in-situ mechanical testing microsystem and a manufacturing method thereof. Background technique [0002] Elastic strain engineering, that is, to adjust the physical, chemical and biological properties of materials by changing the elastic strain of materials, is a nanotechnology that has attracted widespread attention in recent years and has been effectively applied in many fields. For example, as early as the last century, researchers discovered that elastic strain can greatly increase the carrier mobility in single crystal silicon, and it has been applied in the complementary metal oxide semiconductor industry (Complementary Metal Oxide Semiconductor, referred to as CMOS), Generated huge economic value. The application of elastic strain engineering requires in-depth exploration of nanomaterials. With the help of Tran...

Claims

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Application Information

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IPC IPC(8): G06F30/17G06F30/23G16C60/00G06F119/14G06F119/18
CPCG06F30/17G06F30/23G16C60/00G06F2119/14G06F2119/18
Inventor 王宏涛段宇梁春园卜叶强
Owner ZHEJIANG UNIV HANGZHOU GLOBAL SCI & TECH INNOVATION CENT