Evaluation method and evaluation system for interconnection topology on UBB

A technology for evaluating systems and topologies, applied in transmission systems, selection devices, electrical components, etc., can solve the problems of inability to evaluate UBB interconnection topology and low test efficiency.

Pending Publication Date: 2022-05-06
上海燧原科技有限公司
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Problems solved by technology

[0003] Existing evaluation methods for the interconnection topology between OAM accelerator cards are roughly divided into two types. One is to use the tester provided by the connector manufacturer to test the performance of the connector, but it cannot evaluate the interconnection topology of the entire UBB; the other is to use the OAM accelerator card Pass the active test after installation, but OAM needs to be installed and tested, and the test efficiency is low

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  • Evaluation method and evaluation system for interconnection topology on UBB
  • Evaluation method and evaluation system for interconnection topology on UBB
  • Evaluation method and evaluation system for interconnection topology on UBB

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Embodiment Construction

[0035] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only some structures related to the present invention are shown in the drawings but not all structures.

[0036] figure 1 For a flow chart of a method for evaluating interconnection topology on UBB provided by an embodiment of the present invention, refer to figure 1 , the evaluation methods of interconnection topology on UBB include:

[0037] Step S101, at least two test boards are respectively installed in at least two OAM installation areas to be evaluated, so that the differential port pairs in each SerDes are electrically connected to the differential interface pairs on the test board; wherein, the test board is...

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Abstract

The invention provides an evaluation method and an evaluation system for interconnection topology on a UBB. The UBB comprises N OAM installation areas used for installing OAM modules, each OAM installation area corresponds to a set of connectors, each set of connectors comprises N-1 SerDes, N is larger than or equal to 2, and the evaluation method comprises the steps that at least two test boards are installed in at least two to-be-evaluated OAM installation areas respectively, the differential port pair in each SerDes is correspondingly and electrically connected with the differential interface pair on the test board; wherein the test boards are matched with the OAM installation areas one by one, and each test board comprises N-1 differential interface pairs; and correspondingly connecting the differential interface pair on one of the two test boards and the differential interface pair on the other test board to a vector network analyzer, and evaluating the link state between the two to-be-evaluated OAM installation areas according to the S parameter tested by the vector network analyzer. According to the method, the interconnection topology on the UBB can be quickly and efficiently evaluated.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of interconnection topology evaluation, and in particular, to an evaluation method and evaluation system for interconnection topology on a UBB. Background technique [0002] OAM (OCP Accelerator Module) is a hardware acceleration module based on the OCP standard. Compared with the traditional PCIeform factor, the high-speed communication link interconnection between modules has stronger scalability, and the interconnection topology is more complex. An OAM server usually inserts 8 OAM accelerator cards. The interconnection methods between OAM accelerator cards mainly include UBB (Universal Baseboard, universal board) intra-board interconnection and UBB inter-board interconnection through QSFP-DD interface Scale-Out; how to connect Fast and efficient evaluation of the interconnection topology on UBB becomes an important issue. [0003] Existing evaluation methods for the interconnection ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04L41/12H04L43/08H04L43/50H04Q1/02
CPCH04L41/12H04L43/08H04L43/50H04Q1/028H04Q1/135
Inventor 俞武明庆勇师亚帆
Owner 上海燧原科技有限公司
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